Electronics Forum | Mon Dec 22 20:16:17 EST 2008 | davef
The first question in solving the "ol' SMT component loss after second-side wave operation" problem is: So, what makes you think the components actually came-off in the wave and not during some previous 'handling'? Putting that aside, we'll play thi
Electronics Forum | Tue Dec 23 17:34:07 EST 2008 | davef
We hear you talking two main issues: 1 Solder paste release 2 Thoughts on using two passes of solder paste on the stencil 1 Solder paste release * Check your aperture & aspect ratios [Search the fine SMTnet Archives for more] * Do a better job with
Electronics Forum | Wed Dec 24 11:23:22 EST 2008 | childs
I can't seem to locate any information/concerns about moisture entrapment in IC packages on the promary side in a double sided SMT assembly using water soluable solder paste when soldering the second side. A typical process would assemble/reflow/cle
Electronics Forum | Wed Dec 24 11:49:46 EST 2008 | bandjwet
Put on your thinking caps for this one......We are trying to remove a BGA (10 x 10mm, plastic, 0.8mm pitch) which is approx 3 mm next to another BGA (5 x 5mm, plastic, 0.8mm pitch). The challenge is this second device is underfilled with a softening
Electronics Forum | Wed Dec 24 18:31:04 EST 2008 | hegemon
If they share a common ground plane you are in for some difficulty in trying to prevent the second part from heating too much. What happens to the underfill material when it is softened by being heated beyond the 160C? Does it harden up again, or b
Electronics Forum | Wed Jan 14 18:23:05 EST 2009 | boardhouse
konrad, Here are a couple of things that can affect color. 1) Material color is the major, 2) Matte green from Enthone would be different in shad than Matte green from Taiyo. 3) Solder mask is two parts, One the green mask, two the hardner, having t
Electronics Forum | Wed Jan 07 12:42:19 EST 2009 | dyoungquist
We are a small (18 employees) OEM company who also provides EMS to other local companies in our area. Q3-Q4 2008 we did see a small downturn in our OEM sales. Our EMS side actually stayed pretty flat over that same period. Like rob, we have a high
Electronics Forum | Mon Jan 12 02:29:13 EST 2009 | sachu_70
Hi Milan, One cause for such BGA failures could either be a laminate warp (bow or twist) formed during your Reflow or Wave soldering process, or perhaps a warp seen on the BGA component package itself prior to processing on SMT line. IPC guidelines f
Electronics Forum | Thu Jan 15 12:31:06 EST 2009 | wavemasterlarry
Well I finally got the power turned back on at my house. Guess they only let ya slide so long without paying the bill. I still say 4 months is OK - especially inthe winter time. But requardless, wave soldering 0402s is nuts. Getting adhsive to fi
Electronics Forum | Thu Jan 15 12:44:23 EST 2009 | jwolvans
I think it might be useful to differentiate between proto-typing and volume production builds. With a proto-type, I spend very little time preparing documentation as I'm right on the production line baby-sitting the product from start to finish. This
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