Electronics Forum | Wed Jun 09 12:11:11 EDT 2010 | sjohnson
We have been doing pilot runs with vacuum installed on vapor phase. Voids are down but bridges are up on the .5mil BGAs.
Electronics Forum | Fri Oct 22 10:41:08 EDT 2010 | janz
hi 1) just run test batch and pull test wire. Use MIL std to find out your results. 2) again run through and test wire.
Electronics Forum | Wed Oct 20 11:39:01 EDT 2010 | mikesewell
On our Fuji NXT and AIM machines I never program local fids...we place down to 16 mil fine pitch and BGA, uBGA, multirow QFNs with no placement issues. Most boards are panelized in an array and we have corner fids added to the rails. Regards, Mi
Electronics Forum | Thu Oct 21 10:48:05 EDT 2010 | wrongway
depends on the machine the old amistar machines I used local fids they were needed we got new universal machines now it does'nt seem to need them we place down to 16 mil pitch and small bga with no problems at all using global fids
Electronics Forum | Tue Nov 09 23:32:11 EST 2010 | bising
Stencils are 5mils thickness, SS material. Printer is Accela.
Electronics Forum | Tue Jan 11 16:38:18 EST 2011 | gosswald
JMW, Thank you for your reply. Can you add the upward camera to this machine that does not have it after purchase? If so what is involved? I do have typically two items per board that would be below 25 mil pitch.
Electronics Forum | Thu Jul 28 18:12:47 EDT 2011 | asksmt
Hi, what kind of issues i could get if the i do not provide heal properly in my footprint ? In my current design 0603 resistor package footprint heal is missing by 3 mils each side Please help
Electronics Forum | Fri Jul 29 08:22:34 EDT 2011 | mskler
What will be the specifications of solder paste printing for 6 mil thikness in SnPbAg process. Also what will be the control limits fro X bar R chart. Thanks in advance for the help
Electronics Forum | Wed Jan 25 14:40:36 EST 2012 | gaz
We are using 6 mil screens, and these boards have 0603,SOT23 and SOD523. Seems like we could use *more* paste, not less on a lot of these components, so does it make sense to get a thinner screen? Wouldn't this mean we'd get less paste?
Electronics Forum | Fri Jan 27 07:30:54 EST 2012 | scottp
We're in the high rel market and use a lot of 5 mil stencils. They give plenty of paste to meet IPC class 3 and survive over 1000 cycles of -40/+125C thermal cycle testing.
