Electronics Forum: electron (Page 7033 of 7930)

no clean flux + wave soldering issue

Electronics Forum | Thu Aug 28 09:30:20 EDT 2008 | patrickbruneel

Omid, No-clean fluxes need to be used right out of the can without thinning. In the past with RA and RMA fluxes you could adjust or thin them to your desired density because they had plenty of solids up to 30%. No-Clean fluxes have a lot lower solid

no clean flux + wave soldering issue

Electronics Forum | Thu Aug 28 12:03:54 EDT 2008 | wavemasterlarry

My people said I was needed again here on The Forum. Thanks Mr Head for the goddos on wave soldering. It's a hard process to grasp and not every one nows how to adjust eveything properly. I can tell you regognize expertise when you see it. That s

no clean flux + wave soldering issue

Electronics Forum | Thu Aug 28 16:03:08 EDT 2008 | wavemasterlarry

I guess you're adding the gas to keep the fingers clean - sounds likeyou got your threads mixed up on the Forum. Any way I would suggest not doing this. Gas is pretty flammable. I have pix of one our Hollis cleaning machines going up in flames cau

Imm Silver tarnish?

Electronics Forum | Sat Aug 30 11:42:49 EDT 2008 | davef

Some immersion silver [IAg] products can go brown with aging. On a newly plated board, we expect you to see Ag, C, & O. The amount will vary according to supplier and thickness. Questions are: * How uniform is the brown coloration of the IAg on the

Omniflo 5 high temperature warning

Electronics Forum | Wed Sep 03 07:39:19 EDT 2008 | pjc

You may not be getting enough exhaust pull, so the cooling modules over temp. Try swapping blower motors to isolate that before buying one. STANDARD AIR OPERATION: - Load-end: 150 cfm (255 m3/hr) at the 4� (102 mm) stack (minimum requirement) - Unlo

looking for HASL TIN thickness specification

Electronics Forum | Wed Sep 03 16:59:13 EDT 2008 | glennster

At a former employer we required HASL thicknes to be a minimum of 0.75 micron (30 microinches), as measured at the thinnest point on any given pad. This would generally assure a minimum 1 year solderability shelf life. Usually when we saw a soldera

Siemens S-27 Error Code Descriptions and Segment Issues

Electronics Forum | Wed Sep 10 07:42:52 EDT 2008 | lloyd

Can you provide a bit more info on your machine setup. I not full fimilar with the S-27 so a few points may not be relevant to your machine. Are you using Siplace Pro. Are you using the standard GF for the 0201 component. Do you have the component

power relay problems

Electronics Forum | Mon Sep 08 08:59:45 EDT 2008 | davef

You're correct: * Sealed relays should not be cracked or have moisture intrusion. * Hand soldering relays is going to be expensive. [Using a mini-solder pot for this might reduce some of the burden.] The good part is that the problem is gross enough

Uncoalesced solder problem in fine pitch IC pads

Electronics Forum | Mon Sep 08 01:45:35 EDT 2008 | rameshr

1.The Temperature on the pad is 247.C & also it is an lead free profile, the same profile we have used till last lot but we had obsereved this problem earlier to this current batch. 2. Both in Type3 & Type 4 paste we are using because of we are using

Uncoalesced solder problem in fine pitch IC pads

Electronics Forum | Wed Sep 10 12:20:52 EDT 2008 | grics

True words of wisdom. Production managers need product out the door, not tied up in wip waiting on an analysis to go and fight a vendor for errors in their manufacturing. Especially if you are a Low Vol High Mix facility. Quite frankly, the resourc


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