Electronics Forum | Fri Apr 04 05:02:08 EST 2003 | alexyalung
Hi All, The best solution we made on our tombstone defects is component Z dimension set at pick and place machine. Usually for 0402 components Z height is pre-set by the machine at 0.5 mm, by reducing it to 0.35mm we have solve our tombstone problem
Electronics Forum | Wed Apr 02 11:42:28 EST 2003 | ricardof
Hi, we are using coplanarity chek systems on FUJI IP. I understand on a rough standpoint that basically this system is a GO - NO GO filter.But I would like to know if there are any options to have other results (Analytical results) with that option o
Electronics Forum | Wed Apr 02 12:50:01 EST 2003 | rdr
Does anyone know of any standards that deal with the physical location of BGAs on a PCBA? I am looking for something that states to not put BGAs in the center Axis of assemblies for bow and twist reasons. We have always informed customers to locate
Electronics Forum | Mon Apr 07 13:02:30 EDT 2003 | kmorris
Sorry, I forgot to include the stencil thickness. It is 5 mil. Thanks for the input, everbody. I just checked with our stencil supplier & I thought that Electro-polish was standard with lazer, but I now find out it is not. Our stencil did not get
Electronics Forum | Sun Apr 13 17:02:24 EDT 2003 | MA/NY DDave
Hi In addition to DaveyF, I probably have this, yet let me give you a few places fast and you will probably find what you want from his, mine or the linkages. If not write again either way. http://www.edtn.com/ http://www.techonline.com/ http://ww
Electronics Forum | Mon Apr 14 14:30:02 EDT 2003 | jonfox
This may be a little too late, but ever heard of a missing "silver". Had one one time (missing ground plane)and wow look at those TANT caps explode...might need some safety glasses! If they are all open look towards the design a little closer just
Electronics Forum | Tue Apr 22 11:02:42 EDT 2003 | k_h
I'll throw this out there also: http://picturecenter.kodak.com/share?invite=HE2r4mzhP5YLJkvkhU1o It shows void slots (purple) in the copper on the perimeter of the smaller transistors heat sink. Should keep the smaller transistor from moving while th
Electronics Forum | Fri May 02 09:49:19 EDT 2003 | tommyg_fla
3NaH2PO3 + H2SO4 + 2H2 + Ni^0 Potassium is co-deposited with the nickel, as follows: H2PO2^- + Hads => H2O + OH^- + P 3H2PO2^- + P => H2PO3^- + H2O + 2OH^- What is Hads?
Electronics Forum | Wed May 07 09:02:17 EDT 2003 | Kris
Hi SnAg is a binary alloy and does not have the same effect as a ternary SnAgCu alloy as far the pasty range is concerned. But then paste only can do so much. The best way to do it is to have proper pad design, controlled placement and reflow. I w
Electronics Forum | Mon May 26 04:02:13 EDT 2003 | Franky
Dear sir, I think so with every idea , everyone is correct , paste , pattern of pad design ,profiling or solder mask on PCB ,and one of the cause of tombstone that I found is alignment of machine placing and solder printing , from my experience many
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