Electronics Forum: leaded (Page 705 of 789)

Re: Certifying Learnsoft Training

Electronics Forum | Tue Nov 28 22:35:30 EST 2000 | rabell

We are currently in release 1.4 and 1.5 of the majority of our courses, partly because we do fix minor errors that do crop up, and release maintenance updates. I infer from your comment that you take exception to one or more of the test questions in

Re: Paste Push-Out In PP Assembly

Electronics Forum | Thu Jul 20 12:49:05 EDT 2000 | Bob Willis

So far on all my trials on PIHR I have only used standard products as the paste is defined by the printing requirements for fine pitch etc. As most people will have seen you just get a heap more residues with this process and even more with lead free

Which AOI method is best?

Electronics Forum | Mon May 07 09:46:15 EDT 2001 | orbotech

3D imaging refers to the acquisition of images from multiple perspectives using, preferably, multiple sources of illumination, while 2D imaging refers to the acquisition of an image from one perspective. An AOI system with 3D imaging is able to acq

Life of a Solder Stencil

Electronics Forum | Tue May 29 16:52:07 EDT 2001 | hussman

By far the easiest way is to track solder paste measurement on your board - or solder defects after reflow (key word- easiest). Why spend 2 weeks examining a stencil when it clearly doesn't make defects, or IS making defects. I find using 2-D data

Mydata Pick and place

Electronics Forum | Thu May 24 09:11:12 EDT 2001 | Grant Petty

Hi, I would agree. We purchased a TP9 just the slow machine, but we were a small company at the time, and it worked fantastic. Almost no maintenance, and it's a dream to changeover. The serivce in Australia is also very good, but that does not appl

Streckfuss EO14 wavesolder machine

Electronics Forum | Wed May 16 10:37:34 EDT 2001 | davef

Similar to my response to your previous posting on this topic dated 5/8/01, things to try are: 1 Contact your non-supplier [Streckfuss] using the contact points at http://www.streckfuss.com/wave_soldering.htm, obtain source drawings for components o

PIHR Inspection Criteria

Electronics Forum | Thu May 17 22:41:05 EDT 2001 | davef

Hi Bob Still getting the cushy jobs, eh? [Tennent's and McEwans are two of my favorites. "Ahh, Beer! My one weakness...my Achilles Heel, if you will..." Homer J Simpson Quote 89/114] Under "Acceptable" for "Pin-In-Hole/Intrusive Reflow Inspection

Mixing no-clean solder with activated

Electronics Forum | Mon Jun 18 17:41:07 EDT 2001 | genny

Hi, I put this on the technet forum, and I know some of the same people are here, but I thought I might catch others here as well. We have PCB's which are populated at the CM level with no-clean solder paste. However in house we use a solder wire s

QFP Defect

Electronics Forum | Mon Jun 25 20:39:08 EDT 2001 | ianchan

Hi mate, no complete info given from what i see, so just some humble comments, mayhaps you review : 1) PCB pad finishing - Copper+nickle plated? coz if so, nickle is a KILLER to good solder wetting. what we did back here, was to HAL coat the nickle

Clean vs No Clean PCB assembly process

Electronics Forum | Tue Jul 24 19:26:20 EDT 2001 | johnmaetta

Thanks Dave. We develop high-speed telecom PCB assemblies that use uBGA and other fine pitch components. Our policy has been to use an NC process at our CM. Our engineering group, who is also a customer, and uses these assemblies for development,


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