Electronics Forum: has (Page 706 of 1227)

Air Moisture in Production

Electronics Forum | Tue Dec 21 17:56:13 EST 2010 | stepheniii

Am I reading your post correctly? You will print PCBs and not populate them until up to 24 hours later? And you can assemble level 3 components at 30C and 90% humidity, you just have to pro-rate the exposure time. (I don't recommend having those con

CSM84 Ball Screw Replacement

Electronics Forum | Thu Dec 16 20:00:53 EST 2010 | jeffr

Tom, If you need the parts... I can quote and supply them.. A good tradesman can change these parts. You do not necessarily need a Yamaha trained guy to do it. The only issue issue after the exchange of the parts is calibration of the machine, which

Philips Sapphire connectivity...

Electronics Forum | Thu Dec 09 19:05:45 EST 2010 | alexmiri

At the company I work with we have some Phillips Sapphire and Emerald machines, I work at the IT department, Production is asking me if there is a way instead of using floppy's put a converter and use USB, or even better is there a way to put the mac

Conformal coating

Electronics Forum | Fri Dec 10 12:24:46 EST 2010 | davef

Causes of dewetting in conformal coating. Factors that influence dewetting usually involve non-ionic contamination such as: * Residues from board manufacture including silicone surfactants from solder resist & HASL rinse contamination * Component res

Solder Paste Printing to 0.005

Electronics Forum | Mon Dec 27 13:34:28 EST 2010 | ppcbs

Does anyone have any experience in printing solder paste on a 0.0065" pad? I have a requirement to attach single chips with 600 to 2400 connections. The chip has a 0.005" solder ball, 0.010 pitch. Attaching to a substrate with a 0.0065" pad. An

Heat transfer properties of encapsulate potting material.

Electronics Forum | Tue Dec 28 03:59:06 EST 2010 | riscy00

I'm investigating heat transfer by 1st order approximation between PCB and ambient air via encapsulate material (epoxy or gel or silicone), they have thermal conductivity of 0.2W/C but it hard to find specific heat capacity and density. Has anyone

Dip Fluxing Cavity Depth

Electronics Forum | Mon Jan 24 12:11:00 EST 2011 | fdr4prez

Has there been any studies on the effect of the depth of the fluxing cavity for dipping PoP components? I've heard that the cavity should be 50% of the ball diameter and I also heard that the cavity should be 2/3 of the ball height (which may or may

Sayaka SAM-CT23B De-Panelizer Router Question

Electronics Forum | Mon Apr 02 19:26:52 EDT 2012 | GK

I apologize as I cannot answer your question, but I hope you might be able to help me out. We are looking at purchase a Sayaka CT56NJ, how is has this machine been working for you? how is the customer service? Do you have custom fixtures or a unive

Vapor Phase vs Convection for production

Electronics Forum | Mon Feb 21 08:44:10 EST 2011 | kahrpr

They all are inlineish They just carry the board to the vapor chamber. in a reflow system all the boards in the oven from beginning to end are in state of process, which gives you more speed. If the board has a long cycle time VP is not a problem. If

GF-12 APS oven

Electronics Forum | Mon Jan 31 08:59:38 EST 2011 | kennypascarelli

I have an oven that now wants me to tune and can't do anything until I enter a password. The big problem is I don't know the password. Any way to find it or bypass it. Figured it out, the machine has a battery back-up and it needed to be replaced.


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