Electronics Forum: viewed (Page 7054 of 7894)

Topaz X Head Optimization

Electronics Forum | Tue Mar 06 17:24:31 EST 2012 | acsscott

OK, did some more testing this afternoon. First, I moved the LED’s from feeder location #23 to Feeder location 30. This is three down from the other component(#33) it is picking, so it should be able to hit them both at the same time for two of the

SOD323 and SC90 bounceing parts in final PNP stages.

Electronics Forum | Sun Mar 04 09:53:00 EST 2012 | eadthem

What i have on the original 2 problem boards is the parts next to it are SOIC8 and placed using a 125F(.125" dia) 1 of witch is close and we have to Z zone it to place the SOIC last, the others have more than .02" clearance on all sides. The other

solder paste for 200 degs c continuous operation?

Electronics Forum | Wed Mar 21 11:42:54 EDT 2012 | davef

Downhole solder suggestions, in order of preference are: * Kester Sn96.3Ag3.7. Most vendors do not stock straight tin-silver alloys, whose wallet is that fat? * SAC305 can usually be used in place of one of the copper-free tin-silver alloys in downho

solder paste for 200 degs c continuous operation?

Electronics Forum | Wed Mar 21 13:16:11 EDT 2012 | grahamcooper22

What solder alloy are you using at the moment which is coming to the end of its limits ? Normally in general for safe operation of an alloy we don't like to recommend any operation temp that is higher then two thirds of the solders melt point, but th

Universal GSM feeders

Electronics Forum | Thu Apr 19 20:21:07 EDT 2012 | eadthem

You might keep a eye on SMT auctions, Sometimes you can get a good deal. As long as you get the feeder for less than 100-200$ each at auction/ up to 500$ each for a dual lane, you can be assured that you can fix it to fully working if its broken

Solder Fountain Recomendation

Electronics Forum | Thu Mar 29 07:37:45 EDT 2012 | davef

The current discussion about solder fountains has to do with copper dissolution. Broadly, copper dissolution is the weakening of copper traces where a trace and a barrel plating intersect due a loss of the copper into the solder. Longer contact time

PCB labeling using laser (CO2 or fiber)

Electronics Forum | Tue Mar 27 04:39:27 EDT 2012 | andrzej

Have you got some experience with using laser (CO2 or fiber one) to label with barcode your PCBs ? So far I thought it is easy process but now we do tests with many PCBs covered with diffrent soldermasks and fiber laser as well as CO2 has same probl

PCB labeling using laser (CO2 or fiber)

Electronics Forum | Thu Mar 29 09:47:12 EDT 2012 | blnorman

In a previous life we burned bar-codes on PCB with a CO2 laser. Initially we placed a small white epoxy pad to burn the code into. After some experimentation we found that we could eliminate the epoxy and just burn through the soldermask and the un

Samsung CP40CV VME Issue

Electronics Forum | Wed Mar 28 09:59:47 EDT 2012 | bradlanger

Sounds like you have tried everything I can think of as far as hardware is concerned. One thing that sounds suspicious to me if the error "Failed to create empty document". I have only seen that error when my MMI software got corrupted in the process

YesTech F1 AOI false calls and misses

Electronics Forum | Wed Apr 04 13:33:12 EDT 2012 | rway

We currently have 2 M1 systems. Our false call rate has never been has high as you suggest. There is something wrong with your program and/or inspection algorithms, as you probably already know. You should be somewhere between 1000-1500 vcpmo (fal


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