Electronics Forum | Thu Dec 21 08:45:40 EST 2000 | Hussman
I've been asked to "heat up the oven profiles" to "burn off" the excessive flux so our vision equipment can inspect solder joints. 1. I am using Multicore SN 63 no clean solder paste. 2. We use CR Technology Vision Inspection. Before I get too
Electronics Forum | Fri Dec 15 11:45:38 EST 2000 | DaveJ
All, Thanks for your quick response. However, my primary concern is not the question of solderability advantages of nitrogen versus air. With all things (zone temps, track speeds, flow rates, etc.) being equal, what would be the profile differences o
Electronics Forum | Thu Dec 14 21:54:50 EST 2000 | Joseph Scott Dowsett
I am student at Northern Illinois University and am doing a senior design project on applying castellated solder pads (pads on the side of the substrate) to a hybrid circuit. I have had difficulty finding related articles. I found this website and
Electronics Forum | Tue Nov 28 21:07:44 EST 2000 | Alvin K
Gold is porous and spots on gold plated PCBs is one of the drawbacks of using gold as a solderability protector. Base Nickel exposure seems to be the cause of this and is aggravated when the gold thickness is less than what it should be. I agree with
Electronics Forum | Fri Nov 24 01:12:28 EST 2000 | SARRY
Hello! All I am an almost smt biginner. I have a few questions My question is 1. what will be changed to use lead free solder paste in a smt production line? 2. what is the reflow profile for lead free solder paste? Don't just tell me to search th
Electronics Forum | Mon Nov 20 05:45:39 EST 2000 | Daniel Carlsson
Hi! Some varibles that I would think increase the risk: -The use of Nitrogen when soldering. -The use of IR may cause thermal vias (if placed only on one "side") to produce uneven heat distribution and thus wick the comp. -Uneven heat distribution.
Electronics Forum | Tue Nov 14 16:06:27 EST 2000 | zorox
We have an ERSA machine here where we have solder "spikes" occasionally. We have made sure our flux is dispensing properly, we have adjusted z axis speeds, our preheater is heating properly, adjusted XY speeds, etc. Can anyone think of something we m
Electronics Forum | Mon Nov 13 20:55:11 EST 2000 | Dave F
Not too much to go on, bud. Tell us about: * Wire material, finish, insultation, etc * Wetting problem description * Why feed that the wire is used for through is important * Range and extent of the problem * Results of metallographic analysis of "g
Electronics Forum | Fri Oct 27 08:59:17 EDT 2000 | Wolfgang Busko
Antonio: A lot has been said on this topic before. You might try the archives with "solder balling" and than check your process step by step ( you will find enough ) to find the cause of your problem. Any other advice would be repeating and repeating
Electronics Forum | Sun Oct 22 21:18:13 EDT 2000 | Aokilab
This may be the "wetting" problem! Assuming your process parameters are normal (work OK before), the possible reasons: 1. Presence of impurity in the solder; 2. Other impurity (oil or anti-dross) on the surface of the pot; 3. Weak solderability, due
