Electronics Forum: index (Page 7087 of 7890)

Manncorp Pick and Place

Electronics Forum | Mon Aug 04 12:28:42 EDT 2014 | dyoungquist

Mydata (recently changed name to Micronic) will be more expensive than Manncorp but from my experience using Mydata, they are well worth the money. Tech support (in the USA at least) is very good if you go through them to buy the machines. You can

Manncorp Pick and Place

Electronics Forum | Tue Aug 05 21:08:10 EDT 2014 | isd_jwendell

You are correct about the Manncorp machine, it was an MDC machine. The Essemtec machine is old(ish) but still runs fine, and last I knew they were still supporting it. My recent problem with Essemtec was in regards to software. I found a bug and sim

solder paste(SnPbAg)

Electronics Forum | Wed Aug 06 14:49:06 EDT 2014 | dyoungquist

Sn62Pb36Ag2 has a higher liquidus point of 189C as compared to Sn63Pb37 at 183C. You may need to slightly adjust your oven profiles to use it compared to SnPb. We have had good solder-ability and reliability with it in our IPC Class II products. A

Manually Adding Paste at Screen Printer

Electronics Forum | Thu Aug 07 09:24:42 EDT 2014 | tombstonesmt

Good morning everyone! I'm searching through tech sheets and equipment manuals to determine the recommended paste thickness on the stencil during operation. We use a MPM momentum screen printer using SAC305 paste. Board isn't too complex; one QFP, co

J-Wide JW-3040 Manual Printer

Electronics Forum | Thu Aug 14 19:09:41 EDT 2014 | takram

I purchased the JW-3040 manual printer after seeing this company here. They were advertising the JW-3040 as new but their website said they specialize in used products. I specifically asked and was assured that the printer is new and comes with a squ

High Relative Humidity and Blistering Issues in Assembly

Electronics Forum | Sun Aug 17 19:06:42 EDT 2014 | natashakt

Hi All, I have been looking in to some failures of PCB's in Assembly. After SMT the boards are stored for different periods of time in high humity environment (72% RH and 21.4 degrees Celsius) before being sent to Assembly to be handsoldered/put thr

High Relative Humidity and Blistering Issues in Assembly

Electronics Forum | Thu Sep 04 03:26:18 EDT 2014 | eurekadrytech

Hi all: Interesting question you have raised as it concerns the rate of absorption by the board material. I represent http://www.EurekaDrytech.com and could assist in resolving the blistering problems you're facing. First some questions. 1. Is the

High Relative Humidity and Blistering Issues in Assembly

Electronics Forum | Mon Sep 08 21:12:29 EDT 2014 | eurekadrytech

Hello, Manufacturing process with high moisture and humidity environments and long term storage will definitely see pop corning effects once high temperature from soldering and/or re-flow process. The moisture that has been adsorbed is likely the ro

Printing on a pallet

Electronics Forum | Thu Sep 25 07:45:41 EDT 2014 | emcglobaltechnologies

Good morning, I hope you are doing well today, please allow me to introduce myself. My name is John Wasserman and I am the Sales Manager for EMC Global Technologies. We manufacture fixtures and tooling for the processing of printed circuit board ass

High Melting Point Solder with alloy composition of 93.5 Pb 5 Sn 1.5 Ag

Electronics Forum | Mon Aug 25 08:15:54 EDT 2014 | jax

With a melting point of roughly 300°C, you would need to have the product see temperatures peaking around 325°C at a minimum. (I would make sure the components and PCB materials can withstand these temperatures) Most convection ovens do not go over 3


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