Electronics Forum | Thu Sep 22 13:05:29 EDT 2016 | chabscan
Hi I would like to know the process in wich the Quad 4C knows it has the correct component after taking it from the feeder. Recently I've been put in charge of a Quad 4C machine that is used to assemble two different boards. Each one has already a
Electronics Forum | Sat Nov 05 20:18:13 EDT 2016 | sarason
I checked the spec sheet and it gives pressure and no volume. The volume on one of my older Yamaha's was about 2.7 CFM. That corresponds roughly to the volume of a small 2HP compressor at your local hardware store. You can place on of these in a smal
Electronics Forum | Fri Oct 07 08:48:45 EDT 2016 | davef
Two things ... A friend in the contract coating business said: "... the board is not being baked out long enough, 30 min is certainly not long enough depending on how many layers this board is, as the vacuum (from the parylene process) is pulling t
Electronics Forum | Mon Nov 07 11:34:02 EST 2016 | anhsang38
Hi Pro We are using the barcode system for checking MPN when we change the new component reel. My company have been using Microsoft access for showing this string. For each MPN we can change to IPN by this software. Ex: this is barcode data string o
Electronics Forum | Fri Oct 14 11:51:57 EDT 2016 | davef
As you imply in your question, it's counter intuitive that a 2A fuse would blow before an 80mA relay circuit activated in the same circuit. Assuming the 80mA relay circuit is a protection circuit. There's maybe 100 different design goals [ https://bo
Electronics Forum | Sat Oct 22 13:37:46 EDT 2016 | greglac
I am currently working on a custom IC where we plan on using Cu pillars at 80um pitch. I'm am trying to narrow down a packaging solution. My requirements are as follows: 40um Line Width/Space Capability (or finer) 4 layers low loss at mm-wave
Electronics Forum | Tue Oct 25 11:48:03 EDT 2016 | dontfeedphils
Hi, we're currently running a design with a fairly simple BGA. The problem we're running into is poor solderability (cold looking joints, high voiding in the BGA). All of this on a know good oven, with a known good thermal profile. I'm guessing it
Electronics Forum | Sun Dec 11 22:55:22 EST 2016 | ppcbs
What type of flux is in your solder paste? Active or No-Clean? With lead free solder you really should be using an active flux. The lead free oxidizes during reflow if you are not using a Nitrogen or Vapor Phase reflow. So a more robust and activ
Electronics Forum | Fri Oct 28 13:58:57 EDT 2016 | ttheis
Hi everyone, We just picked up an old VIP70 oven and it is in need of more maintenance than we were told when we bought it so I'm working on a few issues. The main thing right now is linking the FCU controller to the PC. I've tried using both seria
Electronics Forum | Sat Oct 29 20:29:30 EDT 2016 | adamjs
Posting here because all the threads asking for feedback on it are locked. We have been extremely happy with the 4300 tacky flux for BGA attachment. Not only is it both washable and no-clean (i.e. wash-optional), it was also the only tacky flux tha
