Electronics Forum | Mon Feb 06 21:24:21 EST 2012 | gaz
By changing paste and making a better profile, it seems like we have enough paste. The process was just not working very well with SN100. So far the 5mil looks good, so thanks for the input!
Electronics Forum | Wed Aug 08 22:04:16 EDT 2012 | davef
I know of no such industry standard. Start with MIL-D-3464E, Desiccants, Activated, Bagged, Packaging Use And Static Dehumidification http://www.wbdg.org/ccb/FEDMIL/d3464e.pdf
Electronics Forum | Tue Jan 15 10:53:18 EST 2013 | boriskilk
We wouldn't advocate extending the soldermask beyond the component body but yes to ganging for fine pitch. To ensure we don't run into issues with flaking our preference is not to add solder mask when the space between pins is less than 6 mil.
Electronics Forum | Tue Feb 12 15:48:40 EST 2013 | emeto
My appertures are 10mil diameter. Using electroformed stencil is probably be my next step. Thank you!
Electronics Forum | Fri Feb 15 12:29:35 EST 2013 | mikesewell
What foil thickness? Type 3 or 4 paste? Have you checked your area ratio(s)? You could overprint or drop your foil thickness by one mil to improve the ratio and paste transfer. As always you can search the fine SMTnet archives for more info.
Electronics Forum | Fri Mar 15 18:11:46 EDT 2013 | isd_jwendell
I've seen 1-mil Kapton tape. Would that work, or would it be too thick? I've never tried it... How thick is the average solder mask?
Electronics Forum | Mon Apr 22 17:13:48 EDT 2013 | hegemon
Might want to double check my figures, but my notes have 2oz copper at 2.8 mils or 71.12 microns in thickness. 'hege
Electronics Forum | Mon May 27 07:16:27 EDT 2013 | mskler
We have an LED 0603 package, We are using stencil of 5 Mil, Before Reflow placement is perfact but after reflow it tis found that there is more than 30% LED are tilt. Can the speed of Fan in Reflow can help or I have to reduce the PAD opening in Sten
Electronics Forum | Mon Dec 30 16:08:08 EST 2013 | emeto
I would also check the stencil thickness. You don't want 7mil stencil for 0402 components.
Electronics Forum | Tue Jan 07 23:38:08 EST 2014 | m_imtiaz
want to know the tolerance the paste height in the solder paste printing. for example if stencil thickness is 7 mil, what will the acceptance level of paste height ( upper and lower) kindly share if any guidelines or formula for the same
