Electronics Forum | Fri May 18 13:41:34 EDT 2001 | mparker
Good ol' Yankee engineering always says "More is better" You have got to be careful that with more epoxy volume you run the risk of the epoxy merging with solder paste if you are using a glue and paste process. In addition, if the epoxy can spread o
Electronics Forum | Wed Jun 06 03:12:06 EDT 2001 | ianchan
Any blokes in process/QA, can recommend a solder volume, measurement machine, that has proven reliability, in its data readings, prefer that it comes, similar to "SMT m/c" camera-program-function, to remove operator-user variation. Appreciate any hel
Electronics Forum | Mon Jun 11 10:41:16 EDT 2001 | techment
Can someone helps to interpret the IPC-A-610's requirement on solder balls ( less than 5 mils in diameters.). We found about 6 to 10 balls ( less than 5 mils ) scattered in a 600 sq mm board. Is it consider failing for class 2 product ?. Thank you.
Electronics Forum | Tue Jun 12 10:13:10 EDT 2001 | techment
Thank you, Mr Dave. Specifically, there are tiny balls spreading on the boards ( on top of solder resists, and not encapsulated). They are not near to any land/pad or connector. I do not think they post any electrical problem. They are quite far away
Electronics Forum | Wed Jun 13 16:13:54 EDT 2001 | Igmar
Have anyone seen this problem: Capacitors (100nF 0805) placed on PCB and then appear cracked after reflow. After reflow, the solder joints look visualy acceptable. Then capacitors fail during testing. When attempting to remove capacitor with hot sol
Electronics Forum | Thu Jun 21 22:35:11 EDT 2001 | me
Yes, Pb Free is coming soon... I am studying both Sn/Pb and Pb Free solders. Obviously the profiles will be much different for both pastes. Not to mention that one of my 0201 resistor vendors is switchng to Pb Free terminations in the near future!
Electronics Forum | Fri Jun 29 14:13:05 EDT 2001 | markhoch
Just a quick thought on solder balls "or beads" caused when using NC paste. I found a spec (12.4.10 in IPC-A-610C) that says solder beads are acceptable if they are entrapped in NC flux residue and can not be dislodged in the normal service environme
Electronics Forum | Sat Jun 30 11:28:24 EDT 2001 | davef
Consider using a roll solder with a flux that well matches the residues you can accept to be remaining on the board when you get finished processing. Many people use a no-clean flux cored roll solder for such operations, because they don't want to c
Electronics Forum | Tue Jul 03 22:18:33 EDT 2001 | davef
Assuming that you are talking about voids in solder connections: * Consider voids on the surface of your solder connection a defect. * Consider voids that you can't see to be a process indicator. See A-610C, 12.4.8 for authoritative guidance.
Electronics Forum | Thu Jul 19 08:04:04 EDT 2001 | dahsr
I have a sealed and refridgerated 350g jar of solder paste (water soluable flux). According to the label it expired July 1st. 2001 after the 6 month shelf life. Can this be used? Why or why not? What is the relevance of the expiration date? Can I re-
