Electronics Forum | Thu Jul 19 08:04:04 EDT 2001 | dahsr
I have a sealed and refridgerated 350g jar of solder paste (water soluable flux). According to the label it expired July 1st. 2001 after the 6 month shelf life. Can this be used? Why or why not? What is the relevance of the expiration date? Can I re-
Electronics Forum | Tue Jul 24 08:22:16 EDT 2001 | markhoch
We're getting geared up to start placing 0402 comps. for the first time. I'm trying to "touch all my bases" before we actually go live. I've verified our placement machine capabilities and investigated my solder paste performance in regards to 0402'
Electronics Forum | Tue Jul 24 08:22:56 EDT 2001 | markhoch
We're getting geared up to start placing 0402 comps. for the first time. I'm trying to "touch all my bases" before we actually go live. I've verified our placement machine capabilities and investigated my solder paste performance in regards to 0402'
Electronics Forum | Tue Jul 24 13:15:22 EDT 2001 | Steve Schrader
Greg, The increased space and hence potentially increased airflow will have no effect on "solderability." It may effect the temperature that the balls see and that is a different issue that can be worked from a profile standpoint if you are not hit
Electronics Forum | Sat Jul 28 05:31:20 EDT 2001 | nop_e
Hi all I just got feedback from my customer about "White residue problem" around solder joints with manaul soldered connector at customer site and included the failure analysis report that there is residues of Cl,S,Na . I 'd like to know, the whi
Electronics Forum | Tue Jul 31 10:41:49 EDT 2001 | ronho
I'm interested in process information from someone who has experience with this package, such as pad design, stencil aperture dimensions, stencil thickness, unique issues, profiling, solder paste. Design is considering this package for future produc
Electronics Forum | Mon Feb 07 13:00:06 EST 2000 | Jose RG
Hi, Last Friday, we had a new defect in our line. We found a nice and shiny solder fillet completelly attached to some component leads (in a SPLCC 84) but the solderjoints were not solder to the pads. (Hasl finishing) Any idea ?? Some contamination
Electronics Forum | Tue Feb 08 03:14:37 EST 2000 | Roni H.
Hi Jose, J-lead are very sesitive to coplanarity, which is the major cause for the defect you described. Other posibility is that there is not enough solder paste ; J-lead need around 10% more solder past then L-lead, You have to consider the screen
Electronics Forum | Sun Feb 06 07:37:29 EST 2000 | Dave F
Albert: Several points: � Bi should have no effect on your no-clean. The flux you select with your Pb/Sn/Bi wire solder could be an area for concern tho. � Bi will form an alloy with Pb with a melting point of 93�C. � Look at "Process Change - Rya
Electronics Forum | Wed Jan 26 14:33:47 EST 2000 | Glenn Robertson
Tuan - How about Sn/0.7Cu? It's M.P. is 227 and it's readily available. If the leads are Gold plated you might consider pre-tinning them. If you need a higher temp alloy any of the major solder companies can help - I suggets you start with Ind
