Electronics Forum | Fri Nov 08 17:49:04 EST 2002 | davef
Questions are: * So, what is your thinking on this "insufficient contact causing intermitten failures"? * How do you print the paste? * Where do you place your therocouples when measuring reflow temperature? * What kind of solderability protection is
Electronics Forum | Tue Aug 25 07:13:20 EDT 2009 | davef
It sounds like the BGA balls are not melting. You're probably getting no collapse. Put a bare BGA on a hot plate. Heat it up until you get collapse. Adjust your reflow profile until you have that temperature on the BGA pads on the board. What is the
Electronics Forum | Wed Jul 09 05:28:35 EDT 2003 | matt kehoe
Photo's can be found at http://www.sipad.com/ssi_qa/smta/microbga.htm mk
Electronics Forum | Mon Jan 12 11:55:58 EST 2004 | Hussman
Hi Gents, Any easy way to deisn the CS or SS side of a board that would show a copper target and how it relates to the tooling of the board? I find that for most baord houses the build up of tollerances can lead to weak traces, especially around BG
Electronics Forum | Wed Jun 22 08:13:28 EDT 2005 | davef
Use an epoxy to repair the solder mask. Sources are: * http://www.circuittechctr.com/index.shtml * http://www.engineeringlab.com/baseboard.html
Electronics Forum | Thu Apr 08 15:27:49 EDT 2010 | davef
Fast or cheap, fast or cheap, fast or cheap ... Tough call, oh yeh, time is money. That's it!!!
Electronics Forum | Sun Feb 16 20:52:34 EST 2014 | staylorebad
IPC-4552 says it does. It specifically talks about ball grid array (BGA) pads so small feature size is included as valid. Scott
Electronics Forum | Wed Feb 10 10:25:24 EST 2016 | capse
Akrometrix is a company here in Atlanta that measures surface topography at reflow temperatures for the PCB and component. They have software that overlays the two sets of data to look for warpage problems. They offers this as a service as well as se
Electronics Forum | Fri May 10 09:07:42 EDT 2002 | xrayhipp
Does anyone know a surefire way to print micro-vias which are centered on BGA pads and also reduces solder ballooning? Would you design a process around two stencils? -- one for the vias themselves and one for the pads. Could you fill all of the vi
Electronics Forum | Fri May 07 12:02:28 EDT 2004 | Dreamsniper
From my understanding paste on BGA pads are applied only to help in holding the component as the PCB is conveyed during the manufacturing process then soldered. But during rework on BGA's do I have to apply Solder Paste or just Flux? What's the diffe
