Electronics Forum: calculations (Page 72 of 87)

Re: what's your opinion

Electronics Forum | Thu Jan 27 20:32:01 EST 2000 | Dave F

Kyungman: So, your boss is trying to get you to put a wet paste inspection machine on your line after the printer. Sounds like you have a bunch of toys and someone wants to give you more!!!! Ah, the burdens some people have to live with!!! ;-) J

Re: acceptable defect rates for smt process, in ppm.

Electronics Forum | Mon Jan 17 12:16:02 EST 2000 | Brian W.

My old company (CM) ran SMT to 50ppm including some very complex boards. We established the normalizer number by: #components + #solder joints. As was stated earlier, the ppm for any given product is the result of many factors. You may get differen

Re: Parts Wastage Allowance

Electronics Forum | Mon Dec 06 04:48:53 EST 1999 | Charles Stringer

Greg This is one of the eternal questions. I have racked my brains over this one in many organisations. If you are a low volume user (as your run size of 100 to 1000 would indicate) then you are likely to loose more taped components from loading and

Re: paste release from stencil, and volume calculation

Electronics Forum | Tue Nov 09 19:45:48 EST 1999 | Steve Thomas

1 Money IS an object, and my boss will be thrilled. The stencil manufacturer recommended ovals to facilitate better release. Seems likely to be true, but whether or not it's necessary I don't know. We have perpendicular walls on these (6 mil) ste

Re: Solder surface tension

Electronics Forum | Sat Oct 09 04:17:21 EDT 1999 | Brian

| Can anyone tell me the formula/method to determine | the amount of weight that solder's surface tension can support. | (ie: Maximum weight of components soldered onto a bottom side | of a board during a top side reflow on a Paste/Paste process). |

Re: Solder surface tension

Electronics Forum | Sat Oct 09 07:33:23 EDT 1999 | Dave F

| | Can anyone tell me the formula/method to determine | | the amount of weight that solder's surface tension can support. | | (ie: Maximum weight of components soldered onto a bottom side | | of a board during a top side reflow on a Paste/Paste proc

Re: Cost per placement measure

Electronics Forum | Wed Oct 13 12:12:04 EDT 1999 | Bill Haynes

Hello Morris, I hope that my superiors don't see your message or they might have me go through all of that to calculate my cost per part mounted. One of the things that has helped me out considerably is an Accounting report that gives me all

Re: IQ/OQ, and PQ

Electronics Forum | Wed Sep 15 11:08:45 EDT 1999 | Dave F

| I am looking for help on doing smt equipment qualifications. I need to find some examples to follow. The equipment to be qualified is a Stencil Machine, Pick and place machine, and Reflow oven. We manufacture medical devices so it has to be somewha

Re: I wonder

Electronics Forum | Tue Feb 12 16:10:21 EST 2002 | Phil the Quality Guy

Six Sigma has been invaluable here at my contract manufacturing group. We have brought out defect rate from a monthly average of 32% to 3 or less percent. Essentially, our inspectors 100% inspect every assembly in final inspection. I constructed a

Re: Standard pad sizes for reflow and wave

Electronics Forum | Fri Sep 03 14:37:45 EDT 1999 | JohnW

| | We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these siz


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