Electronics Forum | Thu Oct 29 08:16:41 EDT 2009 | leemeyer
A Quad IV C would fit your application well. They are work horses. Repair parts are available but they just don't seem to breakdown often.
Electronics Forum | Wed Nov 18 14:09:28 EST 2009 | cyber_wolf
Please let us know how a 10-15K Quad 2C works out for you if that's what you decide on.
Electronics Forum | Thu Oct 29 16:27:37 EDT 2009 | bhartman
Does anyone have experience with the smoke release properties of PCB laminates? I need to pass UL 2043 and I know FR4 does not pass. I also need to be ROHS and otherwise UL listed/recognized material. Thanks.
Electronics Forum | Fri Oct 30 12:14:53 EDT 2009 | nemo
Thanks for the suggestion, but on samsung's website, I only seem to see a paste inspection machine and not a post-reflow inspection machine. Does anyone have experience with the MVP or SAKI AOI machines?
Electronics Forum | Fri Oct 30 14:00:31 EDT 2009 | davef
No standard. While you're waiting others to reply, search the fine SMTnet Archives to find threads like: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=4647
Electronics Forum | Sun Nov 01 10:07:08 EST 2009 | cuperpeter
Hi, Does anyone have english manual for a EKRA E1 screen printers? I would be glad if somebody has one. Thanks, Peter.
Electronics Forum | Mon Nov 02 10:42:03 EST 2009 | ericg2000
Can anyone send me any set up or programming instructions for the Testronics 504 AOI machine. I started a company that has one, but i can not find a manual. All i have the the "help" info inside the software. I've tried contacting Testronics, but
Electronics Forum | Thu Nov 05 10:09:36 EST 2009 | soudomphong
Hi guys, I am looking for a processor board for econopak plus wave solder. Teknor microsystems (TEK234). Please email me if you have or know who has it. Thanks.
Electronics Forum | Tue Nov 10 07:37:32 EST 2009 | scottp
I'm curious why your customer is concerned with BGA voiding. Normal process voids, even well in excess of IPC "limits", don't effect reliability so why monkey with the process to get rid of a non-issue?
Electronics Forum | Tue Nov 10 07:35:04 EST 2009 | scottp
Step 1 is to find out what kind of opens you're getting through a cross-section or die & pry. Are they head in pillow, brittle fracture at the intermetallic, bulk solder cracks, ball separation from interposer? Without some basic failure analysis a
