Electronics Forum: ones (Page 719 of 1373)

Dye Penetrant Inspection of solder joint

Electronics Forum | Fri Jun 27 22:33:16 EDT 2003 | Ben

HI, I'm doing a dye penetrant and peel test of non-function BGA solder joints to locate the fracture surface. After applying dye, I found the dye ink just accumulate at the solder mask edge and spread everywhere after I peeled off the package. THis i

Repairing balls on BGA's

Electronics Forum | Wed Jul 09 10:55:51 EDT 2003 | Veronica

Hi Reman01, I have done that before when I was in Motorola. What kind of ball are you trying to repair? How many pieces of BGA chip do you need to repair a day? If it is not too many, you can do it by yourself. It is a lot, such as 100 to 1000 piece

Repairing balls on BGA's

Electronics Forum | Thu Jul 17 04:42:47 EDT 2003 | sanjeevc

Hi! One technique: 1. Remove all balls 2.Make > a mask(stensil)for reballing.The holes of the > mask must be 0.8-0.9 the size of the pads. 3. > Reball chips 4. Reflow chips Good luck Hi Yes,we have done quite a bit of reballing of BGAs with

Micro BGA pads, adhesion to laminate

Electronics Forum | Wed Jul 09 16:18:51 EDT 2003 | Matt Kehoe

Hi Russ, Thanks for the input. The squeeze out we are reworking is very very thin since it has been flattened so it is actually easier to remove than usual but I agree, with a pad this small it could exert a bit of stress on the bond line if rework

solder fillet peeling update....

Electronics Forum | Tue Jul 15 11:18:29 EDT 2003 | slthomas

It is an interesting situation....one that merits as much business philosophy analysis as technical analysis. I'll be getting my official 60 day notice today. Any criticism about our overseas suppliers (that were selected by sr. management w/o in

CP642's vision process error

Electronics Forum | Wed Aug 06 14:52:15 EDT 2003 | cyber_wolf

Checking the vacuum at all stations is a good place to start. A vacuum guage with a piece of hose attached to a CP nozzle is a very handy tool to have. If you notice less vacuum at any one of the stations, you can start by looking @ the spool valves

Cookson selling Speedline

Electronics Forum | Wed Jul 30 21:20:07 EDT 2003 | davef

It's good for Cookson shareholders that something has forced the managers of Cookson to come to their senses, finally. All those aquisitions never made sense to anyone, except the MBAs and lawyers that reaped the fees from all that paper shuffling.

Cookson selling Speedline

Electronics Forum | Thu Sep 25 18:22:16 EDT 2003 | adlsmt

Just one comment about used equipment. A reason Mr. Bliss gave as contributing to Speedlines woe's. Its a fact of life. Would you buy a car you cant sell in a few years??? Why buy new? Because its faster, better, etc. if its not you won't buy new. My

Wave Soldering Upflow

Electronics Forum | Tue Aug 05 21:18:24 EDT 2003 | cardinal

Hi, One thing you might want to do has to deal with the venting over the top of your spray fluxer. Many times the exhaust comes from the side; instead of directly inline on top of the spray fluxer. This will draw the flux up the thru-hole joints m

Immersion Tin Tarnish

Electronics Forum | Fri Aug 08 06:44:33 EDT 2003 | Matt Kehoe

Emergency!!! We have a small run (5) of very dense boards that have an immersion tin finish. They were built in April/May and have a heavy tarnish appearance on them, smd pads and through holes. We are being asked to apply ssd to the surface mount pa


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