Electronics Forum | Fri Apr 30 08:28:39 EDT 2004 | davef
Roger Saunders, President Saunders Technology, Inc wrote a fairly unbiased paper that compared different thermocouple attach methods. You can probably find it on their site. In it, about gluing thermocouples, he says: There are two general classes
Electronics Forum | Sat Feb 02 18:30:35 EST 2008 | mika
File meny > Save for the Web. I know that the Adobe Photoshop is not in every man's hand. Even though I know that there is a some good free-ware that can do similar to this, converts for ex. a jpeg to a smaller size jpeg, without to loose to much of
Electronics Forum | Tue Jun 26 19:59:08 EDT 2001 | davef
They always tell you to calculate ROI, when they want to blow you off. Do a net search using - calculate ROI. Links to three pretty good descriptions on this are: http://www.dmreview.com/editorial/dmreview/print_action.cfm?EdID=2487 http://www.eval
Electronics Forum | Thu Jun 24 19:14:44 EDT 1999 | Mike Konrad
Very good questions Bob� Given the fact that my company is a manufacturer of batch cleaning equipment, I will speak more in general terms rather than in specific terms. There are several criteria used in the evaluation of batch aqueous cleaning sys
Electronics Forum | Thu May 21 22:15:05 EDT 1998 | Earl Moon
| | Y'all: IPC set-up a site addressing the environmental issues of the printed circuit fabrication industry. Some of it is interesting and applicable to the assembly business as well, even though not aimed directly at assemblers. IPC has recently
Electronics Forum | Fri May 22 11:56:04 EDT 1998 | Bill Schreiber
| | | Y'all: IPC set-up a site addressing the environmental issues of the printed circuit fabrication industry. Some of it is interesting and applicable to the assembly business as well, even though not aimed directly at assemblers. IPC has recent
Electronics Forum | Sun Apr 19 16:13:14 EDT 1998 | Steve Gregory
| All, | Does anyone know a good book, software, Check list etc. | to analyze and develop the whole electronics assembly | and manufacturing process ? | I mean, not only SMD-process but also unit assembly | and final assembly ? | I assume that ulti
Electronics Forum | Tue Aug 31 17:36:36 EDT 2004 | davef
NO-LEAD COMPONENTS WITH LEAD SOLDER ISSUE: We agree with Russ. We've dicussed this several times on SMTnet. For instance, look here http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=25394 LEAD COMPONENTS WITH NO-LEAD SOLDER ISSUE: We disa
Electronics Forum | Fri Nov 04 11:29:46 EST 2005 | JeffP
Jay, I work for a company that manufactures batch reflow ovens however, I will try to be as subjective as possible. For the most part, what others have posted is true. Yes, there is one heating chamber and if the heater does not have enough power
Electronics Forum | Wed Jun 03 22:07:41 EDT 2009 | davef
= 0.66 aperture opening to the stencil wall has been shown to provide the best transfer efficiency and repeatability of the deposited paste. Values from 0.66 to 0.8 insure a good paste release from the stencil. The biggest impact on area ratio is the
