Electronics Forum | Thu Feb 10 10:28:56 EST 2000 | Russ
Okay, Okay, here is the rest of the story! These boards were definitely plated, reworked to HASL, The component that is the most succeptable is a 160 pin QFP .5mm pitch. This component has nickel/iron lead frame. Significantly reduced apertures (1
Electronics Forum | Thu Feb 10 13:01:29 EST 2000 | Wolfgang Busko
Hi Russ, yes, I did get the homeplate info, thanks. Thought that it looks that way, only didn�t know how to deal with that expression. Now your problem: it�s hard to tell without seeing it actually. All I wonder is this 80sec above liquidous, at what
Electronics Forum | Thu Feb 10 22:41:20 EST 2000 | Dave F
Russ: Now that�s a good story. Nuff said on the Vegas trip, that explains everything. Especially when you say "it must have something to do with ..." I love WS609. It�s been berry, berry good to me. Intermetalic Layer (IL). A compound formed a
Electronics Forum | Wed Feb 09 16:09:06 EST 2000 | Doug
Does anyone have any ideas on setting up a parts library/database on an SMT line? We would like to identify a particular part by it's package style, instead of by the customer's part number, in order to reduce the amount of entries in the library.
Electronics Forum | Fri Feb 11 12:21:44 EST 2000 | Finepitch Services
Doug, What I've done in past was calling them as 1206T.5, 1206T1.0, SOIC16, RESNET16, SOIC16T5.0, ALCAP4, ALCAP5 etc. T means thickness but for the ALCAP case 4 means 4mm diameter. If you have the time and patience, having a board and attaching a s
Electronics Forum | Thu Feb 10 04:07:29 EST 2000 | Wolfgang Busko
Jeff: We had a similar problem a couple of years ago with boards from one specific subcon. At first sight the joints looked well formed sometimes with a little bit more sometimes with a little bit less solder but still in limits not to be worried abo
Electronics Forum | Wed Feb 09 21:37:37 EST 2000 | Dave F
Rob: Someone's out there turning over stones, eh? Roller Tinning, Rolled Solder. In printed circuit fabrication, a surface coating of tin-lead, typically 1-2 microns thick, applied to preserve solderability. Still available from some fabricators
Electronics Forum | Fri Jan 19 12:17:57 EST 2001 | slthomas
Thanks Dave. Talked to a few people at APEX this week and if nothing else, had my frustration reduced some. Of course I made sure I talked to mfg. people and avoided the design guys like the plague. ;) I actually picked up a copy of 785 a while bac
Electronics Forum | Mon Jan 15 16:32:46 EST 2001 | Darby
Adrian, I'll go again. The term "snap off" on it's own refers to the distance between the bottom of the stencil and the top of the pcb. Sometimes referred to as "print gap". As you prefaced your question with "squeegee snap off" I thought you were as
Electronics Forum | Thu Jan 18 04:30:52 EST 2001 | johnwatt
Ok so for me, spray fluxing is the way to go every time....for one you don't need to worry about colapsing your foam with pallet's that are hot or worrying about your pummace, your thinners, SG and so forth...man life in foam fluxer land was hard. N
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