Electronics Forum | Thu Jul 20 13:28:13 EDT 2000 | Bob Willis
On all the trials I have done I have made no changes to the stencil thickness or apertures than the normal changes we make for our process. I have not changed any thing in terms on volume of solder for more reliable joints. I fact I have not read any
Electronics Forum | Thu Jul 20 16:42:52 EDT 2000 | Bob Willis
Here are the details for the OU Lead-Free Project Introduction The Open University Solder Research Group aims to facilitate the implementation of lead-free solders by evaluating their mechanical properties, especially those which are influential to
Electronics Forum | Thu Jul 20 12:49:05 EDT 2000 | Bob Willis
So far on all my trials on PIHR I have only used standard products as the paste is defined by the printing requirements for fine pitch etc. As most people will have seen you just get a heap more residues with this process and even more with lead free
Electronics Forum | Fri Jun 23 20:45:12 EDT 2000 | Lee
Hi Dave, You make a very good point. I think that the concern over lead is not so much in user's contact with the lead during the product's active life, but after its disposal. There is some valid concern over lead leaching out of circuit boards
Electronics Forum | Thu Jun 22 13:12:47 EDT 2000 | Lee
Good question Brian. I'll answer this briefly and try to get back to the subject after I get back from a meeting I have to be at shortly (sorry about that!). There are lots of ways to define this new field, but one relatively simple definition is u
Electronics Forum | Thu May 03 10:23:33 EDT 2001 | davef
Yes, Alpha's frames help develop upper body strength. All stencils, regardless of the type of frame, can have loose foils. Stencils with removable foils require a specialized storage system for the foils and lots of band-aids. Some foil frame su
Electronics Forum | Tue May 29 12:35:36 EDT 2001 | genny
Dave, Sorry to drag this out some more. When I saw this thread I realized that we often get PWB's fabricated with a gold plated edge connector tab. However we have not ever given any specs to the fabricator regarding the gold plating - all we say i
Electronics Forum | Mon May 07 09:46:15 EDT 2001 | orbotech
3D imaging refers to the acquisition of images from multiple perspectives using, preferably, multiple sources of illumination, while 2D imaging refers to the acquisition of an image from one perspective. An AOI system with 3D imaging is able to acq
Electronics Forum | Tue May 08 03:14:12 EDT 2001 | sinclair
We started our first ENIG process recently and to our surprise, we have many failure on the one and only BGA on the board. The BGA is a 31 mils pitch plastic. Sending the PCBA to 1 cycle of heating/cooling @ 70/-5 degree C yield 40% of failure. With
Electronics Forum | Tue May 08 15:05:08 EDT 2001 | davef
It�s reasonable to want to understand this strange looking fabrication, before moving on to other issues. Before moving on to that, tell us more about your thinking the silicon being from the BGA package. What kind of plastic package is this? Desc
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