Electronics Forum | Tue Jul 24 08:22:16 EDT 2001 | markhoch
We're getting geared up to start placing 0402 comps. for the first time. I'm trying to "touch all my bases" before we actually go live. I've verified our placement machine capabilities and investigated my solder paste performance in regards to 0402'
Electronics Forum | Tue Jul 24 08:22:56 EDT 2001 | markhoch
We're getting geared up to start placing 0402 comps. for the first time. I'm trying to "touch all my bases" before we actually go live. I've verified our placement machine capabilities and investigated my solder paste performance in regards to 0402'
Electronics Forum | Fri Aug 03 19:03:32 EDT 2001 | seand
Hello John, What is the key reason requiring that this unknown material be injected from below vs. dispensed prior to placement. Is it an issue with reflow temperatures, effect on placement/thermal expansion? Is this a true requirement or specul
Electronics Forum | Thu Jan 27 21:28:36 EST 2000 | G Henning
strong interface to CAD for programming a must. Integrate with MRP systems, online (web based) component parameter data? No CAD data? Why not scan the blank with the P&P and recognize footprints/ designators. Diagnostic messages must be concise and a
Electronics Forum | Mon Jan 31 21:11:09 EST 2000 | Dave F
Dave: Find: "Comprehensive Surface Mount Reliability Model Covering Several Generations of Packaging and Assembly Technology", by J. Clech et.al. IEEE Trans on Comp. Hyb. and Manuf. Tech. Vol. 16, No. 8 Dec. 1993, p.949. It listed cycle to failure
Electronics Forum | Thu Jan 13 12:27:59 EST 2000 | Dave F
All things are possible Grasshopper. You have two choices: 1 Some no-cleans are cleanable. Talk to your sales rep. 2 Rosin based fluxes are cleaned in hi-rel aps, but not cleaned in many less than hi-rel aps. Be aware that in both instances, you
Electronics Forum | Thu Dec 09 04:53:36 EST 1999 | Glen brain
Hi, It is wavesoldering defect, in single- sided copper board, using alcohol-based rosin flux. It is not a bridging between the protruding leads but a metallic (I think, it is solder) link, varies in dia./thickness, connected the basement of solde
Electronics Forum | Mon Oct 18 11:42:04 EDT 1999 | Dave F
Each month: 1 Follow your regimen of inspection and replacement of pathetic looking fingers 2 Routinely replace every Xth finger each month. (Or something like that) Select the "X" based on your local conditions. Obviously, the replacements shoul
Electronics Forum | Wed Oct 13 14:27:08 EDT 1999 | mikeh
Dave F, We are currently using a latex based ambient/thermal cure material that is applied by hand or automated dispensing equipment. Printing is an option for us, but we have not had much luck with this particular material. The mask is peeled off a
Electronics Forum | Fri Oct 08 17:12:31 EDT 1999 | Dave F
| Hi, | | Does anybody know what is the minimum gold plating thickness on the PCB goldfinger required by the industrial specifications - IPC, Bellcore, etc. Where can I find the information? Appreciate for the help! | | Thanks, | Tony | Hi Tony:
