Electronics Forum | Tue Mar 01 10:04:21 EST 2005 | Rob
We used durastone pallets, where you mill out the profile of the panel or board and it sits flat for printing. We secured them using 3M spray mount (for singled sided) and Kapton tape. Obviously helps to have bottom side heating in the oven as you
Electronics Forum | Sat Apr 30 14:02:42 EDT 2005 | steve
I'm confused on nozzle rods as a description. Thru-hole desoldering is achieved by fluxing the the leads that are on the bottom side of the board and then coming in with a desoldering gun. You place the tip/nozzle of the gun against the side of the l
Electronics Forum | Sun Sep 25 11:18:16 EDT 2005 | CS
Hi! I'm facing a strange problem where PCB expanded in X & Y-axis after bottom-side reflow. When the PCB send for Top-side printing process, it is abvious that the printing alignment on the PCB's pads are out. With the problem mentioned above, I am
Electronics Forum | Sat Jul 29 13:30:17 EDT 2006 | Chunks
Some have a bottom side adaptor plates with pins to make contact to certain areas of your board. The top side may have one or multiple heads that can move the entire area of your board. On each of these haeds is a pin like that from an ICT machine.
Electronics Forum | Thu Aug 17 09:24:28 EDT 2006 | markb
We are looking to possibly counterbore a coule of thru holes in one of our PCBs. We would counterbore the top side, and the only trace is coming out of the bottom side. The reason is to mount some LEDs flush with the board. They have some flash wh
Electronics Forum | Mon Aug 11 09:59:40 EDT 2008 | John S.
Guys, We're seeing what looks like an issue where through hole solder joints from our ive solder process are cracking during the cooling phase of the soldering process. This was detected during thermal shock testing, and we have tracked it back to a
Electronics Forum | Wed Sep 23 15:16:22 EDT 2009 | davef
Santiago can still maintain his current PTH, SMT, Reflow, Glue, Wave solder process flow and print glue with a stencil. In this, the bottom-side [contact-side] of the glue stencil requires cutting pockets that correspond with the clinched PTH leads.
Electronics Forum | Tue Jun 15 22:31:06 EDT 2010 | Mag10
Depending on the how you plug the via, the void level can significantly affected. If you have via plugged from the bottom side; i.e. opposite side of the component, you will see alot of void due to entrapped air in the via hole. I found work best wh
Electronics Forum | Tue May 31 22:40:24 EDT 2011 | bejrananda
HI All, Please kindly advice me, I have project that it has DPAK part (MPN:SUD25N15-52 E3 Plating:100% Sn matte)which locate on bottom side (1st reflow), Good wetting for 1st reflow.. but .. when I run Top side (2nd reflow).I found that this D
Electronics Forum | Tue Feb 05 16:06:48 EST 2013 | mlevesque
We are looking for a new BGA rework station. We got an ERSA IR550A and we are not very satisfied. I'm not sure that IR reflow is the better solution because the top-side heating is too large. I think is better with a convection "forced-air" heat.
