Electronics Forum | Thu Oct 28 23:45:23 EDT 1999 | DGrenier
JC: Seen this before, many times. We fixed our problems at the co I work for by giving a packaging specification to our purchasing dept. Took some work but the payoff was pretty big. This document includes such things as orientation,pitch,tape type
Electronics Forum | Wed Oct 27 17:27:58 EDT 1999 | John Thorup
well... it might be cheaper. But I think it's a bad idea. First, your operators will hate you by the end of the day with their sore feet, not to mention lost productivity. Second, safety. Even if the plates are connected to ground through a resistor
Electronics Forum | Wed Oct 27 22:58:56 EDT 1999 | Jeff Sanchez
Hany, John is right! How do I know cause I have a metal wire floor. I was faced with the same problem you are faced with now and the price was up there. I had one advantage, My floors where raised wood when we got the shop. This reduced the fati
Electronics Forum | Wed Oct 27 07:38:08 EDT 1999 | Mario
Hi Jerry, I have a solution for you which I have done myself and shown to others which should cost you less than 100$ if you already have a microscope.This is still an operator job and an automated operation. You need two mirror squares (about 4inc
Electronics Forum | Mon Oct 25 14:48:29 EDT 1999 | William
All, I am having a problem with joints being soft after SMT. Especially 25 mil and smaller parts. It seems as though you can slide the leads right off of the solder. It takes only about 30-40 oz. of compression at 45 deg. to move leads off of join
Electronics Forum | Mon Nov 01 11:07:36 EST 1999 | William
Thank you so much Dave for all of your wonderful help. You know, all I really wanted to know was a little more about the gold porosity problem. Since I am not an expert on gold immersion, nor do I claim to be, I just wanted some information so that
Electronics Forum | Wed Oct 27 16:55:38 EDT 1999 | Joe Herz
Jerry, In our house we generally run a glue bottom last but people do it both ways. Our logic revolves around protecting components from being knocked off the board during handling and processing prior to wave solder (this is most important with sm
Electronics Forum | Tue Oct 19 22:43:31 EDT 1999 | Stu Leech
We are deeply involved with this question because we have developed a much faster way to remove moisture from PCB's. PCB's absorb varying amounts of moisture at differing rates. The rate is influenced by the laminate type board configuration , loca
Electronics Forum | Tue Oct 19 14:56:55 EDT 1999 | JohnW
Nick, I've run this flux for a while and it's not too bad. There is a tendancy for there to be residue left on the PCB after wave due to the solid's content but it can be minised by putting some effort into setting up your spray fluxer to an optimum
Electronics Forum | Thu Oct 14 18:02:31 EDT 1999 | JohnW
Bryan, 0402's tombstonning isn't that uncommon and usually the 1st reaction is alway's the pad size aint right. If you've followed the IPC guidline's normally you should be fine but I'd double check the component supplier's spec's as well. brian's p
