Electronics Forum: amps (Page 7257 of 7929)

Placement accuracy

Electronics Forum | Wed Feb 07 20:57:31 EST 2001 | Kyle

What are you placing on this equipment? If you are placing flip chips, you need to have a glass plate test system to verify your machine is accurate and repeatable. If you purchase new equipment and plan to place flip chips or ultra fine pitch, it

solder balls

Electronics Forum | Wed Feb 07 21:56:00 EST 2001 | davef

Every critter out there with large incisors adapted for gnawing and nibbling has a different theory of solder ball formation. [My theory: It�s punishment for using NC fluxes. Stand and deliver. My solder balls end-up in the gross filter connected

solder balls

Electronics Forum | Thu Feb 08 09:07:22 EST 2001 | Hussman

OK, without knowing the specifics, why does everyone blame the oven? Most solder balls occur around R's and C's in almost every shop I've been to. The best place to start looking is the screen printer - not the oven. Sure the oven is the last proc

AOI systems

Electronics Forum | Fri Feb 09 17:46:50 EST 2001 | raton

We've used them for several years now. They have done what they were purchased for and more. But, as time goes on, expectations of them rise, sales and marketing hype them as the ultimate cure-all of all defects, and then disappointment is experien

BGA shorts

Electronics Forum | Wed Feb 14 21:14:45 EST 2001 | davef

BGA Shorting 1 Damaged mask in between the BGA pad and via on the substrate. 2 Poor print registration. 3 Poor via segregation from the pads? Are they tented or is there just a dam in between? 4 Review the profile. You can run into a number of p

No residue low tack adhesive film for registration

Electronics Forum | Thu Feb 15 19:44:50 EST 2001 | davef

I assume Roland [er someone like that] explained on the Main Conference also known as the Forum, the blue "New Thread" button near the middle of the page and 1 1/2" in from the right margin as the preferred way for posting a new thread. [Well, if th

Substrate Au/Ni thickness

Electronics Forum | Thu Feb 15 19:41:38 EST 2001 | davef

What do you mean by "But after performing temperature cycle test, the former aging rate (from the shear strength ) seems faster than the latter."? Comments are: I can't recall having heard the term "precipitation hardness" [not that that means anyt

Wave Solder Immersion Depth, Contact length, Dwell Time etc.

Electronics Forum | Thu Feb 15 23:52:31 EST 2001 | Dreamsniper

Hey guys, I ran a couple of profile in our wave solder machine using wave optimizer and this is what i got: Parallelism = 0.0 Immersion Depth = 2.1mm to 2.4mm with varying immersion time from 1.1 sec to 3.1 secs. Contact Length = between 5.0 to 6.0

Wave Solder Immersion Depth, Contact length, Dwell Time etc.

Electronics Forum | Fri Feb 16 02:00:12 EST 2001 | PeteC

Dreamsniper, The optimum contact (dwell) time in the wave should be 2 seconds. Contact band width is a function of conveyor speed. For an example, 5cm of contact band width at 150cm/min. conveyor speed will give you 2 seconds of contact time and 2cm

EPA Certification

Electronics Forum | Mon Feb 19 13:31:25 EST 2001 | billschreiber

Hello Mark, EPA Certification can be a tremendous help to the user that is evaluating new cleaning processes. Let�s face it, if it wasn�t for the Earth�s ozone layer, everyone would still be using CFCs and a vapor degreaser to clean stencils, PCBs


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