Electronics Forum | Mon Feb 26 19:56:24 EST 2001 | davef
SMTnet Archives used to have copious amounts of information on a pin-in-hole [e.g., pin-in-paste, paste-in-hole, etc] reflow process, but much of that appears lost with the conversion to the new and improved site format. In getting started, check:
Electronics Forum | Mon Mar 05 13:08:16 EST 2001 | billschreiber
Hi Roger, Our customers use their Smart Sonic Stencil Cleaners for cleaning SMT and wave pallets. There are two primary protocols used. 1) If you have a large quantity of pallets and they are becoming contaminated rapidly, a dedicated stencil clean
Electronics Forum | Wed Mar 07 20:43:55 EST 2001 | davef
Sure, the rolling action of the paste creates a weak magnetic field surrounding the paste. This is similar the field created by electric current flowing through a wire, as first described by James Maxwell. After creation of the magnetic flux, the m
Electronics Forum | Wed Mar 07 20:37:38 EST 2001 | davef
I agree. The bar coded label you use should not be affected by the solder mask of the board. The label should have sharp contrast between the segments of the code to modulate the returned light and allow the reader to discriminate between light and
Electronics Forum | Thu Mar 08 09:38:35 EST 2001 | blnorman
We've been using pre-printed labels on our PCB's for years, with 8 - 10 hours a week down time associated with them. Last October we put a CO2 laser marker on one of our lines. In 6 months we've had a total of 30 minutes down time. We use a 2D b
Electronics Forum | Thu Mar 08 05:49:11 EST 2001 | Dreamsniper
Hi, We are encountering a shortage on our parts and our purchasing said that the parts, which is in PLCC packaging, is hard to order from the local and international market and we can only get them in QFP packaging. Now the problem enters here. Our P
Electronics Forum | Wed Mar 14 11:51:24 EST 2001 | fmonette
Popcorning is the common designation for defects related to the moiture sensitivity of plastic molded components, like PBGAs. The plastic body of these parts will absorb moisture from the ambiant atmosphere on your factory floor. If a critical level
Electronics Forum | Wed Mar 14 18:17:40 EST 2001 | mparker
Some thing to watch out for is the cure spec for the adhesive. Will that match with your solder paste reflow spec? You will have two dissimiliar materials going through endothermic reactions at the same time. You could end up with under cured adhesiv
Electronics Forum | Thu Mar 15 15:36:39 EST 2001 | traviss
Don�t be afraid of the more standard doubles sided mixed process. Even without a chip wave it works, don�t get me wrong it works better with the chip wave, but even without chances are you will be spending more on the additional steps than you would
Electronics Forum | Wed Mar 14 17:52:49 EST 2001 | davef
6 Work Life Test 6.1 Obtain a stencil with 15 to 20 rows of a series of 0.025 by 0.050 inch apertures spaced 0.050, 0.040, 0.025, 0.015, 0.010, 0.010, 0.025, 0.040, 0.050 inches apart. See Appendix 1. Source of supply: Metal Etching Technology.
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