Electronics Forum: viewing (Page 7284 of 7892)

Re: pcb design for bga grounding.

Electronics Forum | Fri Aug 13 04:12:41 EDT 1999 | ray hare

| | I am currently involved with designing a pcb which will use 225 pin bga,s | | The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is | | use the middle 6 or 7 rows of balls as the

Re: Srceen Printing control parameters

Electronics Forum | Thu Aug 12 22:31:10 EDT 1999 | Dave F

| Hello, | | Can any netters suggest what critical parameters should be considered & what are there assoicated impacts for a solder paste printing process ... | | B.Regards, | Felix | Felix: There are some 30 variables that affect SMT solder qua

Re: Reflow oven for solder side components??

Electronics Forum | Wed Aug 11 15:48:54 EDT 1999 | JohnW

| We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave or

Re: Reflow oven for solder side components??

Electronics Forum | Wed Aug 11 15:58:39 EDT 1999 | Doug Philbrick

| We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave or

Re: Reflow oven for solder side components??

Electronics Forum | Thu Aug 12 19:30:22 EDT 1999 | Kris Harris

| We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave or

Re: Reflow oven for solder side components??

Electronics Forum | Fri Aug 13 07:26:06 EDT 1999 | Brian Conner

| | We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave

Strange problem with my dispenser

Electronics Forum | Tue Aug 10 15:56:30 EDT 1999 | Jason Gregory

Has anyone ever heard of this? I have a Camalot System 5000 and we were in a pinch to produce some prototype boards. We needed Sn62Pb36Ag2-no clean in a dispensing mesh. All I could get my hands on was some Interflux paste in a jar. The formulation i

Re: Pick N Place UPS

Electronics Forum | Wed Aug 11 23:55:19 EDT 1999 | Dean

| | I appreciate you're input on this, John, Scott. It's a neat thing Mydata did with the power out, status saved feature. That comes in handy a lot down here. | The problem is with our machine, however, "I think", is that we have one of our phases

Re: no clean rework

Electronics Forum | Tue Aug 10 07:47:12 EDT 1999 | Brian

| | | hello to everybody, | | | we have a really satisfactory no clean process, both smt/reflow and wave soldering, but we get troubles with defects rework; | | | does anybody know how to eliminate flux residues or how not to produce them during rew

Re: no clean rework

Electronics Forum | Tue Aug 10 20:22:15 EDT 1999 | Wayne Sanita

Hello, Could be that touchup operators are using too much flux. What are you dispensing flux with. Disposable or refillable flux pens are good to have around. | | | | hello to everybody, | | | | we have a really satisfactory no clean proc


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