Electronics Forum | Tue Oct 12 04:33:15 EDT 1999 | Brian
| | | We have three buckets filled with leftover solder paste from our screen printing process. Kester has informed me that they no longer take paste, but only dross and pot dumpings. Does anyone know if there's someplace I can recycle this, or am
Electronics Forum | Mon Oct 11 05:48:17 EDT 1999 | Brian
| I am checking out trays for packing of Simms, and I would like to know what are the main differences between Anti-Static and Conductive trays. Anti-static are cheaper, but I would like to know about properties of one against the other, what are var
Electronics Forum | Mon Oct 11 06:00:27 EDT 1999 | Brian
| Folk's, | | I'm just tying up some loose end's on my Master's Thesis on solderballing @ wave soldering and the effect the topography of the mask / PCB has on it. | I was wanting to do a straw poll on you guy's as to the type of resist's you are us
Electronics Forum | Mon Oct 11 12:24:07 EDT 1999 | John Thorup
| | Folk's, | | | | I'm just tying up some loose end's on my Master's Thesis on solderballing @ wave soldering and the effect the topography of the mask / PCB has on it. | | I was wanting to do a straw poll on you guy's as to the type of resist's yo
Electronics Forum | Mon Oct 11 13:05:51 EDT 1999 | Dave F
| | Folk's, | | | | I'm just tying up some loose end's on my Master's Thesis on solderballing @ wave soldering and the effect the topography of the mask / PCB has on it. | | I was wanting to do a straw poll on you guy's as to the type of resist's yo
Electronics Forum | Sat Oct 09 09:50:04 EDT 1999 | Ken Fong
Hi, We are using mixed technology in our PCBA. Would like to know whether there is any criteria governing/guiding the use of mixed technology in such aspects as: 1. Some SMDs cannot be used in some kind of PCB materials such as FR1? 2. Some SMDs are
Electronics Forum | Sat Oct 09 04:17:21 EDT 1999 | Brian
| Can anyone tell me the formula/method to determine | the amount of weight that solder's surface tension can support. | (ie: Maximum weight of components soldered onto a bottom side | of a board during a top side reflow on a Paste/Paste process). |
Electronics Forum | Sat Oct 09 07:33:23 EDT 1999 | Dave F
| | Can anyone tell me the formula/method to determine | | the amount of weight that solder's surface tension can support. | | (ie: Maximum weight of components soldered onto a bottom side | | of a board during a top side reflow on a Paste/Paste proc
Electronics Forum | Fri Oct 08 16:36:28 EDT 1999 | Glenn Robertson
| We've recently encountered this problem where one of our .050" pitch BGA's were reflowing at the wave thus causing shorts... The board was profiled with probes stuck to a QFP solder joint, an 0603, and one of the BGA joints. There was an almost 7
Electronics Forum | Fri Oct 08 16:36:59 EDT 1999 | Dave F
| We've recently encountered this problem where one of our .050" pitch BGA's were reflowing at the wave thus causing shorts... The board was profiled with probes stuck to a QFP solder joint, an 0603, and one of the BGA joints. There was an almost 7
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