Electronics Forum: electronics (Page 7290 of 7890)

Re: Losing parts in wave

Electronics Forum | Wed Oct 06 11:58:33 EDT 1999 | Wolfgang Busko

| | | I hope that someone can help me with my problem! I am experiencing a lot of glued on parts falling off in the wave solder machine. A little information about my process: 1)We use Loctite 3609 glue that is used up long before its shelf life 2)

Re: Losing parts in wave

Electronics Forum | Thu Oct 07 06:02:38 EDT 1999 | Wolfgang Busko

| | | | I hope that someone can help me with my problem! I am experiencing a lot of glued on parts falling off in the wave solder machine. A little information about my process: 1)We use Loctite 3609 glue that is used up long before its shelf life

Re: 0402 part identification

Electronics Forum | Wed Oct 06 09:23:47 EDT 1999 | Wolfgang Busko

| I would like comments on how the industry handles 0402 parts, regarding identification. Since the parts are too small to be labeled, how can we accurately identify the parts and or values, either before or after assembly? | When the boards go to te

Re: HELP!! via sizes, location

Electronics Forum | Tue Oct 05 12:42:43 EDT 1999 | Chris May

| I am a new employee at a company that has had a large turnover of employees over the past year. I am working on a board (components on one side only), the engineer (he is also new ) wants to use an .035 pad with a .021 dia. hole, there are no via's

Re: help help! Water clean for CSP/BGA package

Electronics Forum | Tue Oct 05 06:03:37 EDT 1999 | Graham Naisbitt

| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl

More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 00:26:04 EDT 1999 | Karlin

| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 08:41:42 EDT 1999 | Dave F

| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n

Re: double sided step by step

Electronics Forum | Tue Oct 05 02:31:06 EDT 1999 | Eric

| | Hi everyone, I need some help on the whole process of double sided surface mount. We have been doing surface mount for about 3 months and we're getting ready to take on our first doule sided board. I just need some step by step process regarding

Re: Cost per placement measure

Electronics Forum | Wed Oct 13 12:12:04 EDT 1999 | Bill Haynes

Hello Morris, I hope that my superiors don't see your message or they might have me go through all of that to calculate my cost per part mounted. One of the things that has helped me out considerably is an Accounting report that gives me all

Re: Pay scale

Electronics Forum | Mon Oct 04 06:04:59 EDT 1999 | Joe Fields

| | What is the average pay that a SMT Programmer would get? The machines would be Fuji and Universal. | | This is going to open up a can of worms involving phrases relating to monkeys and peanuts. I have come across a spectrum of scales depending on


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