Electronics Forum | Thu May 20 03:22:21 EDT 1999 | Earl Moon
| Hello everbody! | | I was wondering if any of you have any GOOD recomendations of WEB sites to post one's resume? I've sent my resume here of course, but am looking for others as well... | | I've already been to www.monster.com, www.assemblyNet.c
Electronics Forum | Thu May 20 18:08:57 EDT 1999 | DEON NUNGARAY
| hello...can somebody help me regarding the POPCORN at Reflow. What is this POPCORN at reflow, what it looks like, its cause and corrective action if there is... | | your help is greatly appreciated...thanks | | omat marasigan | Deon Response:|
Electronics Forum | Wed May 19 13:13:20 EDT 1999 | Dave F
| We care currently running into problems during our plug via process: | At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.This is
Electronics Forum | Wed May 19 11:01:17 EDT 1999 | Vince Whipple
Wes, I have been involved with many customers changing over from an alcohol based no-clean to a VOC-free process. The change-over can be made easier by such things as air movement, convection preheat, "drains" or reliefs in pallets (if used), contr
Electronics Forum | Wed May 19 14:09:29 EDT 1999 | JohnW
Wendy, I've done this before using a machined piece of FR4 material to hold the board (machined like a DEK plate )in place at the press . It ensures that the boards are alway's in the right place and that none of the components are damaged..also sto
Electronics Forum | Tue May 18 14:47:02 EDT 1999 | Dave F
| Looking at the full convection reflow oven market, I see two segments, high mass heater ovens (i.e. Electrovert Omniflow,...), and low mass heater ovens (i.e. Heller,...) | Did some of you guys did some testing on both types and what were your find
Electronics Forum | Sun May 16 10:11:50 EDT 1999 | M Cox
| I'm running memory module product- SMT double reflow ( 12 modules per panel). I'm using the epoxy base solder paste in order to reduce the flux spattering problem onto the gold finger which could lead to the intermittent contact problem. | | I do
Electronics Forum | Thu May 20 11:51:37 EDT 1999 | KT
| I'm running memory module product- SMT double reflow ( 12 modules per panel). I'm using the epoxy base solder paste in order to reduce the flux spattering problem onto the gold finger which could lead to the intermittent contact problem. | | I do
Electronics Forum | Fri May 14 13:42:21 EDT 1999 | andy blair
I am currently an employee of Cabeltron Systems in Ohio. Our manufacturing divisions have been outsourced to Celestica, strictly a business deal. No hard feelings there. Our building is located in Southern Ohio and will soon be vacant with 300 people
Electronics Forum | Thu May 20 10:09:16 EDT 1999 | Eric Maddy
| I am currently an employee of Cabeltron Systems in Ohio. Our manufacturing divisions have been outsourced to Celestica, strictly a business deal. No hard feelings there. Our building is located in Southern Ohio and will soon be vacant with 300 peop
