Parts & Supplies | Chipshooters / Chip Mounters
JUKI 103 NOZZLE E35037210A0 JUKI E5112715000 BU SPACER (0.8) JUKI E5113715000 BU SPACER (1.0) JUKI E5114715000 BU SPACER (1.2) JUKI E5115706000 LEVER 24 JUKI E51157060A0 LEVER 24 ASM. JUKI E51157060B0 LINK ASM JUKI E5115706AB0 RINK 24 ASM JUKI E511
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Parts & Supplies | Pick and Place/Feeders
JUKI FEEDER FF24MM PART E51157060B0 LINK ASM Other juki parts: E5103729000 CHIP BOX E5104729000 CHIP BOX CUSHION E51067060A0 SWING PLATE 25 E5106706AA0 SWING PLATE 24FS-OP ASM E5112715000 BU SPACER (0.8) E5113715000 BU SPACER (1.0) E511471500
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Parts & Supplies | Pick and Place/Feeders
JUKI FEEDER part E513070600B E9630729000 T AC SERVO MOTOR(TS4632N2020E600) E9630755000 RERAY UNIT E96307800A0 HEAD SENSOR ASM E963171500A DUCT (KD-76-03-C) E963171500B DUCT (KD-76-045-C) E963171500C DUCT (KD-76-085-C) E9631721000 LAHD SENSOR
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Parts & Supplies | Pick and Place/Feeders
JUKI FF 44MM feeder tape guide E72037060AC E9630729000 T AC SERVO MOTOR(TS4632N2020E600) E9630755000 RERAY UNIT E96307800A0 HEAD SENSOR ASM E963171500A DUCT (KD-76-03-C) E963171500B DUCT (KD-76-045-C) E963171500C DUCT (KD-76-085-C) E96317210
Parts & Supplies | Chipshooters / Chip Mounters
JUKI 102 nozzle E35027210A0 JUKI E5112715000 BU SPACER (0.8) JUKI E5113715000 BU SPACER (1.0) JUKI E5114715000 BU SPACER (1.2) JUKI E5115706000 LEVER 24 JUKI E51157060A0 LEVER 24 ASM. JUKI E51157060B0 LINK ASM JUKI E5115706AB0 RINK 24 ASM JUKI E511
New Equipment | Fabrication Services
Our Service PCB Assembly and PCB&PCBA design are our main business.We are able to undertake a high quality Printed Circuit Board Assembly on competitive prices and flexible conditions.We are a complete “One- Stop” resource for printed circuit board
Technical Library | 2007-01-03 16:36:58.0
Solder paste dispensing is not a new process. However, today's microelectronics present a daunting array of technical challenges to meet deposit size requirements. The need for better paste formulations, more precise equipment, and more tightly controlled processes is driving paste suppliers and equipment suppliers to develop new methods and materials. The most challenging solder paste deposits are those smaller than 0.25mm in diameter and today’s electronics demand such deposits. This paper addresses the process requirements for solder paste micro-deposits in terms of material, equipment and process variable control required for success in producing 0.25mm and smaller deposits.
Industry Directory | Distributor
Custom-Fasteners.com specializes in manufacturing hard to find micro screws to specification, supplying OEMs and manufacturers worldwide.
Industry Directory | Manufacturer
Supplier of High-Tech Low-Cost Printed Circuit Boards with 1-48 layers from 24h express. Flex, flex-rigid, metal core, impedance control, blind & buried vias as well as SMD Stencils.
Technical Library | 2015-05-28 17:34:48.0
The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization. This presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Adaptive Process Control can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow.
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