New Equipment | Fabrication Services
Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74 x 74mm Services include: PCB layout and
New Equipment | Fabrication Services
Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74x74mm Service include: PCB layout and BOM
Industry News | 2019-10-17 15:26:25.0
Practical Components announces that it will showcase its advanced technologies in representative AAT Aston’s exhibit at Hall A2 Stand 578 scheduled to take place November November 12-15, 2019 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2009-08-19 19:57:56.0
Rosenheim, Germany — August 2009 — Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that it will feature the MT2168 system, test socket solutions, and ATE board design services in booth 2602 at the upcoming SEMICON Taiwan exhibition, scheduled to take place September 30-October 2, 2009 at the Taipei World Trade Center in Taipei, Taiwan.
Industry News | 2011-01-05 17:46:58.0
Practical Components Inc. announced the availability of daisy chain samples of Amkor Technology, Inc.’s TMV® PoP (Package on Package) solution.
Industry News | 2011-02-14 15:30:27.0
Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, will exhibit its leading test solutions in Booth A45 at the upcoming Burn-in & Test Socket Workshop, scheduled to take place March 6-9, 2011 at the Hilton Phoenix East/Mesa Hotel in Mesa, AZ.
Industry News | 2011-04-07 11:31:09.0
Practical Components announces that its dummy components have been invited to be part of the "Future Proof Assembly Line" at the upcoming National Electronics Week exhibition, which is scheduled to take place April 12-13, 2011 at NEC Birmingham, United Kingdom.
Industry News | 2013-02-21 07:08:43.0
Multitest, announces that it has been awarded a 2013 NPI Award from Circuits Assembly magazine in the category of Test & Inspection – Functional Test for its InStrip 3D.
Industry News | 2015-11-17 12:24:20.0
November 17, 2015 -- At last week’s Productronica event held in Munich, Germany, FCT Assembly was honored with a Global Technology Award for its new, VOC-free stencil coating, NanoSlic® (www.nanoslic.com). This award win comes on the heels of several successes for NanoSlic, including recent expansion of the company’s licensing network and increased use of the coating technology among global electronics manufacturing firms.
Industry News | 2018-10-18 10:24:05.0
The Design Principles of Stencil Apertures
