Electronics Forum: 0402 size (Page 8 of 17)

Pad Sizes

Electronics Forum | Thu Dec 24 01:38:36 EST 1998 | Chris Grendler

I need advice on a pad design which several other engineers whom I work with would like to try. I think it is an utterly crazy but I can't seem to convince them differently. My current 0402 chip pad sizes on alumina and FR4 substrates are .022"X.

Fine pitch & PCB finish

Electronics Forum | Tue Feb 22 10:44:12 EST 2005 | Dougs

when you talk about stencil design, what would you recommend for aperture size on fine pitch if the customer insists on hasl finish on fine pitch devices? i usually use a 10% reduction on everything we have been using ( 16mil pitch and upwards and 0

unmarked chip resistors

Electronics Forum | Fri Sep 15 04:09:15 EDT 2017 | philc

Yageo announced their decision to stop marking SMD resistors back in 2013, and since then we have started to see 0603's that aren't marked, but larger sizes - so far - are still showing a value. 0402's have never been marked, and I doubt they ever w

What happens to overheated solder?

Electronics Forum | Wed Dec 20 12:49:06 EST 2006 | paul_bmc

I am looking for white papers or information on what happens to 63/37 solder paste alloys when overheated. I have had some solder joint analysis done regarding missing finish on some of the joints. The analysis came back showing a low lead content

Stacking/piggyback chip.

Electronics Forum | Tue May 24 13:18:43 EDT 2011 | leemeyer

We had a Quad 4C that was fitted with a dispensing nozzle. It was perfect for jobs like this. Place the 1st component in the paste, add a dot or 2 of paste to the top of that part and then place the 2nd component on top. I beleive that you may be ta

ENIG poor wetting

Electronics Forum | Tue Jul 30 12:15:15 EDT 2002 | Rick Lathrop

Hi Dave, The paste applied to the board ends up on the tombstone. The pad has a thin covering of solder most of the time, this is why I think they call it a dewet. Occasionally the pad shows some areas of gold and very rarely are some pads not wet at

85K grant. How best to use?

Electronics Forum | Fri May 20 03:14:03 EDT 2016 | designhaus

Hello, We are about receive an 85.000 USD award grant towards purchasing manufacturing or testing equipment for our company. We are trying to figure out how to best use this grant. Here are short facts about us: We are a design house, so all our ma

Solder balls on Ceramic

Electronics Forum | Mon Mar 21 12:49:16 EDT 2011 | Nigel @ Rakon

I am having issues with Solder balls on Ceramic devices, all LEAD FREE SOLDER. The cermaics are only 7x5mm in size. The balls appear around the 0402 capacitors. I have a varying humidity from 15 to 40 %rh which is slightly low but I cannot control.

Year of introduction for standard SMD passives?

Electronics Forum | Wed Feb 04 11:52:27 EST 2009 | steverog

I am trying to find out the year of introduction for each of the standard SMD passive parts. I require this information for a piece of research I am conducting In particular I would like to know in which year the following part sizes were first intr

Bottomside SOT23 opens & DOE test board layout

Electronics Forum | Thu May 24 16:45:57 EDT 2001 | kmorris

Hi All: We�ve got a problem here with opens on bottom side wave soldered SOT23s. Based on past experience and review of the SMTnet archives, I feel that our main problem is pad size. We have the same size pads for bottom side SOT23s as we have for


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