Electronics Forum | Tue Nov 01 15:31:20 EST 2005 | bigdaddysoy9
What ended up being the problem?
Electronics Forum | Tue Nov 01 08:23:20 EST 2005 | pjc
No can do. FPD was designed for leaded components. Nozzles and head not for BGA. No retrofit avbl either.
Electronics Forum | Fri Jan 13 14:19:20 EST 2006 | chunks
What are you two ranting about?
Electronics Forum | Thu Feb 16 09:27:20 EST 2006 | russ
SMT adhesive? Might be able to cure in wave process?
Electronics Forum | Thu Feb 23 02:51:20 EST 2006 | INGE
I forgot: I'm not dealing with a medical device company. But they demand the same one! See you
Electronics Forum | Tue Feb 28 11:55:20 EST 2006 | Brick
SuMoTe, Do you wear the bunny suit style Smock?
Electronics Forum | Thu Feb 23 13:50:20 EST 2006 | TM
What PCB Material should we be using for RoHS/Lead Free Assembly?
Electronics Forum | Tue Mar 07 11:56:20 EST 2006 | fastek
You're a good man Rob.
Electronics Forum | Mon May 01 10:01:20 EDT 2006 | ???
i would also exporse yourself to spellcheck.....or was that expose????
Electronics Forum | Tue Jun 27 10:41:20 EDT 2006 | aj
No. We went straight from Lead Alloy to SACX. aj...
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