Electronics Forum | Wed Jun 25 09:42:09 EDT 2003 | caldon
SR. Here is a shot in the dark but have you try'd KNS? I know they have been working on some cool polymers...send them a note as they may have something that meets your needs. They may not have anything that can be removed but it is worth a try. pol
Electronics Forum | Fri Mar 26 07:31:38 EST 2004 | Alan
I believe that a company called AEGIS with a product called Circuitcam might be able to address your needs. We currently use Circuitcam with Gencad files, but it can also handle gerber inputs. Their contact info. is Phone: 215 773 3571 Ask for Bob
Electronics Forum | Tue Apr 20 06:39:12 EDT 2004 | Ian White
Andy Tyco Electronics can supply these parts. In the USA contact Tyco Electronics in Willow Grove PA. (215) 657 6202 and ask for Service and Support. In UK please contact Tyco Electronics EMEA in High Wycombe ; 01494 464088 And ask for Operations De
Electronics Forum | Wed May 25 22:36:17 EDT 2005 | KEN
...just placed 100 xilinx 1681. These have the integrated heat sinks and bubba these need a lot of heat. You end up with 0402's on the very end of the board that get very hot (225-230) just so you can get the xilinx up to 215C at the balls.
Electronics Forum | Sat Jun 04 01:39:39 EDT 2005 | adlsmt
It would appear that pure tin is backward compatible with leaded processes. This makes it a great finish, as if you migrate all your parts over time there is no issue mixing them. I am not aware of any finish that eliminates the possibility of tin wh
Electronics Forum | Wed Aug 03 04:33:39 EDT 2005 | aj
if you have enough free space at the edge of the board you could try some titanium supports, I have to use these on some products to prevent warping. Also, in relation to profile and I know there are a lot of variables to consider but is 225 not a b
Electronics Forum | Sat Oct 01 01:25:30 EDT 2005 | ck
Sorry theres a mistake on previous question. It should be lead free component termination but non lead free solder alloy Sn63/Pb37. The reflow profile i am using : Soaking temp. 120 to 160 deg C; time 90 to 120 sec. Peak temp. 215 to 225 deg C; time
Electronics Forum | Thu Jan 25 04:11:09 EST 2007 | aj
Tricky stuff. I would expect to hit between 210-215 peak temp on Lead process. What sort of profile are you using? I would imagine a good soak zone would be critical- I have never had BGAs on bottomside so cant really advise any further,i will be in
Electronics Forum | Tue Jan 30 03:44:17 EST 2007 | frank63
Thank you for feedback and comment. We are trying this again, increasement of solder temp to reach 210-215 peak temp. This is also our norml guideline, but in the past the colleagues had observed problem with that PCB, so reduced it. I let you kno
Electronics Forum | Wed Aug 15 10:21:15 EDT 2007 | severs
Sounds like you might need a firm with experience. Jade Equipment Corporation is ace with this kind of work having been a captive machine builder to IBM for almost 60 years. Here is a link to their corporate slide show. http://www.jadecorp.com/cp2005
