Electronics Forum | Mon Nov 29 10:13:02 EST 2010 | vetteboy86
My research starts here. I'm just beginning to research the effects of using a leaded part in a no lead process. Before I began, I know there are temperature differences. The part in question has a 260 C spec. Next I would like to find out if any c
Electronics Forum | Mon Nov 11 10:51:40 EST 2013 | dyoungquist
Are you using lead or lead-free solder? 260C would be good for lead solder but may be a bit low for lead-free. We run our lead-free selective solder pot at 300C although we do not have any pre-heat or top heat, just hot nitrogen blowing around the
Electronics Forum | Tue Jul 22 05:03:55 EDT 2014 | vdprs
Hi Everybody! For this time I was using Philips Topaz (old type, not X or not Xi). In net I found full user manual (pdf file, 420 pages) and corrupted service manual (pdf file, 260 pages). In service manual only chapters from 1 to 10. Needeed other
Electronics Forum | Thu Dec 18 08:18:48 EST 2014 | kevinb
Does anybody know what material is used for over molding I/Cs. I would like to find a material that others use to mold there electronic components. I am wire bonding and mounting a small cap (0201) on an FR-4 board. I need this material to withsta
Electronics Forum | Tue Dec 27 06:52:34 EST 2016 | luciano
Thanks for your advice. I've tried setting the temperature up and even measuring the temperature at the wave itself but had no luck at all. I've also tried using temperatures going from 245 ºC up to 260 ºC. The amount of flux was adjusted as well a
Electronics Forum | Wed Sep 12 03:52:45 EDT 2018 | shascoet29
Hi, Is the IPC-A-610 applicable to CSP assemblies? Especially regarding the solder ball to solder ball distance versus the minimum electrical clearance for assembly(0.13mm/IPC-A-610). With a 0.4mm pitch component and 260 microns diameters balls, thi
Electronics Forum | Thu Jun 06 15:18:56 EDT 2019 | gregoryyork
Honestly, If I ever have an SMT problem it's when a profile is at 230-235C. We encourage minimum 240C and typically 245-250C. Many components call for 260C. Some Paste manufacturers advocated 230C in the early years of Lead Free and it was a disaster
Electronics Forum | Wed Dec 13 16:47:41 EST 2000 | Michael Parker
It is apparent that you have evaporated the flux before you reflowed. You got lucky when the paste slumped and you didn't get major problems elsewhere. A more reliable solution is to adjust the stencil apertures for the part that is experiencing bri
Electronics Forum | Wed Dec 13 18:41:33 EST 2000 | Steve A
Chris, I am not a chemist, but my best guess would be that you were able to remove some of the solvents from the paste flux without exhausting too much of the activators. The loss of solvents could have cut down on violent boiling (violent boiling
Electronics Forum | Wed Dec 13 20:42:57 EST 2000 | Dave F
Material Dk @ 1GHz tan d @ 1GHz Difunctional 4.40 0.020 Multifunctional 4.43 0.018 Polyimide 4.06 0.006 Cyanate ester 3.65 0.005 Bismaleimide triazine 2.94 0.011 PPO-epoxy 3.85 0.012 PTFE-glass 2.60 0.001 PTFE-mat-CE 2.79 0.003 PTFE-ceramic 4.06 0.00
