Industry News | 2013-02-26 16:18:07.0
Engineered Material Systems debuts its DB-1568-1 Low Temperature Cure Die Attach Adhesive for attaching semiconductor die in temperature-sensitive devices.
Industry News | 2016-08-09 19:59:05.0
Saline Lectronics, Inc., a leading electronics contract manufacturer, recently installed the Stinger on its DEK Horizon 03iX printer used on a high-volume SMT Line. The company plans to add the Stinger to its other DEK printers in the future.
Industry News | 2013-06-20 19:31:51.0
Tresky, announces that its wide range of die bonder products from simple and inexpensive to fully automatic are designed to provide simple, precise and reliable solutions for many applications within the microelectronics industry.
Industry News | 2022-03-30 14:59:52.0
YINCAE is excited to announce that we have developed DA158N die attach materials which is thermal conductive and electrical insulating adhesives. It can be fast cured at low temperature. The development of DA 158N is preparing the materials for people to live in the Mars.
Industry News | 2015-03-23 18:07:36.0
KYZEN will showcase its new stencil cleaning products with its distributor, Envoy, in Stand L501 at FIEE Brazil, scheduled to take place March 23-27, 2015 at Anhembi in São Paulo, Brazil. KYZEN’s stencil cleaning products have been designed from the ground up to meet the tough challenges of cleaning no-clean, lead-free residue from small, 01005 apertures while being compatible with modern nano-coatings as well as with all the modern offline cleaning equipment currently used in the industry.
Industry News | 2022-12-14 12:10:28.0
StenTech Inc. will introduce its new Advanced Nano Coating at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. Additionally, the company will have its complete product line of various stencils and tooling on display – Meet with the StenTech team in Booth #2150!
Industry News | 2014-12-11 17:22:23.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), continues to meet the challenges for micro materials testing with the introduction of a new test method for the evaluation of die strength by means of cantilever bending where 3 point bending is not suitable for die with a thickness of less than 50 microns.
Industry News | 2010-04-16 01:50:52.0
Building on a rich history of industry honors and product accolades, Henkel Corporation was once again recognized for its innovation initiatives at the recent APEX event in Las Vegas, Nevada. Two of the company’s most recent product advances, Loctite PowerstrateXtreme Printable (PSX-P) and Hysol ECCOBOND CA3556HF, were at the top of the leaderboard for two well-established honors programs.
Industry News | 2022-04-20 14:08:21.0
Indium Corporation is announcing the release of InTACK™, a drop-in, robust tacking agent for power module assembly at PCIM Europe, May 10-12, Nuremberg, Germany.
Industry News | 2023-01-30 16:10:55.0
StenTech® Inc. received a 2023 CIRCUITS ASSEMBLY NPI Award in the category of Screen/Stencil Printing Peripherals/Consumables for its new Advanced Nano Coating. The award was announced during a ceremony that took place Monday, Jan. 23, 2023 in San Diego.
