Electronics Forum | Thu Feb 27 08:59:15 EST 2020 | spoiltforchoice
In both cases, it will depend on storage conditions, unless you do something horrible to them (or as previously mentioned, wash them) months & months. For boards we put through SMT and then stash for THT loading in smaller qty's I don't think we've e
Electronics Forum | Thu Jun 28 17:05:46 EDT 2012 | davef
Here’s what we seem to know: * There’s a problem with voiding in the solder connections of SMT capacitors * A void is an open area caused by air or process fluid that is trapped within a solder connection * Voids are an allowable condition as long as
Electronics Forum | Fri Jun 24 08:47:14 EDT 2005 | grantp
Hi, There are many aspects to consider. 1. Firstly the room needs to be designed so it's sealed, so linoleum floors than curve where the wall meets the floor, so dirt does not get trapped in the corners, and mops get all dirt and pick it up. Floor
Electronics Forum | Tue Jun 27 17:26:03 EDT 2000 | John Thorup
Hello Christopher You should do just fine without vacuum evacuation of the bag. Just squeeze out any excess air. Just be sure that you use active desiccant (I.E. fresh or baked). This assumes normal environmentals. I suggest that you download the
Electronics Forum | Thu Apr 26 16:52:53 EDT 2001 | fmonette
Robert, Someone already mentioned the popcorning phenomena. This would show up as a dome-shaped deformation underneath the component, due to internal delamination around the die area. However what you describe sounds like another moisture-related
Electronics Forum | Tue May 14 14:48:33 EDT 2002 | fmonette
Hi Dason, Here is some relevant information that you might find useful : J-STD-033, section 7.1.2.2 Dry Box : "Components may be placed in a dry box, capable of maintaining 25+/-5C and less than 10%RH. Nitrogen or dry air may be used." In other w
Electronics Forum | Thu Apr 14 06:54:02 EDT 2005 | teera
hi! below are the item need to check: 1)top plate condition(under screen squeegee). 2)under screen clean contact position(with stencil) 3)make sure the thickness of wiper paper not so thick(not over 6o gm)becaue it will effect the vacuum suction. 4)s
Electronics Forum | Fri Nov 04 02:23:58 EST 2005 | grantp
Hi, Yes, you will save a lot of money in the end. From what I have experienced you cannot heat up a oven full of air, and cool it down fast enough to match a suitable reflow profile. So passing the board through the zones using an inline oven is th
Electronics Forum | Wed Feb 22 20:11:59 EST 2006 | slthomas
*Qualify* your equipment by running X boards, Y times, through each piece of equipment under normal operating conditions and quantifying the performance, as in a ppm rating. Then validate your process by defining all of the steps you use to generate
Electronics Forum | Tue Dec 13 17:41:04 EST 2011 | davef
A Study Of 0201’s And Tombstoning In Lead-Free Systems, Phase II Comparison Of Final Finishes And Solder Paste Formulations http://sheaengineering.com/Documents/APEX%2008%200201s%20and%20Tombstoning%20phase%202%20paper.pdf CONCLUSION The condition
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