Electronics Forum | Fri Nov 04 13:24:30 EDT 2011 | tombstonesmt
Peelable masking has been our solution here recently. We an automovite customer that requires coating on both sides of the boards with many keep out areas. We are currently building a dispense robot that will apply tech spray wondermask 2218. The won
Electronics Forum | Mon Jun 19 21:32:15 EDT 2000 | Dave F
Frank: Good luck on finding a specification. The right combination of material properties will greatly improve the lifetime of your flip chip component. Your flip chip supplier might be best starting place to determine underfill properties that ma
Electronics Forum | Mon Aug 23 10:11:55 EDT 2010 | flipit
Hi, I have never been able to find an acceptable dispense process for dispensing small dots of solder paste. I currently have an auger screw automated dispense system and can not accomplish 0.010" dot sizes. In addition, stencil printing is much m
Electronics Forum | Thu Sep 20 03:31:42 EDT 2018 | minhhaioh34
Hi all, I need some pro help me with issue bubbles after coating. some information for some pro: Machine: Asymtek Chemical: Achime AVR80 Oven: IA 4 zoon4 ( setting 100 100 90 80 conveyor speed: 0.6 m/min). I had happened before and after the oven. W
Electronics Forum | Fri Jun 12 17:26:48 EDT 2009 | sadamson
I'm not the Asymtek expert on this subject but you have to run a ROI study. When you buy a system you have to look at how much time you are spending on masking. If every job is a one board special, then you may be better off spraying on a coating. Ho
Electronics Forum | Tue Jul 31 10:16:59 EDT 2012 | silverbullet
We are in the process of revamping our conformal coating room. Presently, we have a C-740 Nordson Asymtek coating machine that sprays most of our boards with Dow Corning 2577. We are spending a lot of time masking boards and are thinking of upgrading
Electronics Forum | Sat Oct 27 12:01:32 EDT 2001 | Stefan Witte
Most of the machine suppliers Fuji, Siemens, Universal and Panasonic did regret that they were building glue machines. Applying adhesive compared to placing a component looks so simple, but it is not and the defect rate is higher than placing 1206 c
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