Electronics Forum | Thu May 14 04:11:33 EDT 1998 | JACK CHEN
| Does the temp. profiles used to reflow double sided pcb's through a IR oven | on FR4 board material have to be re-established if it is changed to | polyimide? Boards will be baked out prior to assembly. | any response would be most appreciated.
Electronics Forum | Wed Jul 21 01:57:48 EDT 2004 | Thomas
Hi, It is in Celcius. Baking at 2hrs at 110�C , did not help. The problem is consistent and happens at random locations. Fresh flux and new foaming tank has not done the trick also. But I am looking into the contamination issue under scope.
Electronics Forum | Thu Feb 14 07:33:24 EST 2008 | cyber_wolf
Does anyone have any experience with this component ? We seem to have some warping issues through reflow. We have tried everything profile wise....pre bake parts etc.
Electronics Forum | Fri Jul 25 07:26:45 EDT 2008 | realchunks
From what I can understand, you say this only happens on one type of BGA (?). Try baking this BGA. You may have out gassing during rework. Do you use tacky flux during rework? If so, try a different flux. And last, check your rework profile.
Electronics Forum | Wed Sep 22 15:03:46 EDT 2021 | emeto
Excessive baking can actually lead to oxidation and create solderability issues. Why would you profile with empty board? But even if you do that, better use solder sample board.
Electronics Forum | Tue Jul 18 01:28:49 EDT 2023 | hazira1991
Hardly can say, possible also. As in store the packaging all good yet i do plan to do baking before run on next production on coming oct. while optimize my profile. Any better suggestions? really appreciate
Electronics Forum | Sat Nov 24 15:44:28 EST 2007 | mika
Hi DaveF, I had a short look into the Nr1. IMPACT OF MICROVIA-IN-PAD DESIGN ON VOID FORMATION Most interesting reading, but one thing though, I could not find any information about the oven profile. Just a picture of it. My question is of about the
Electronics Forum | Wed Jul 17 12:07:48 EDT 2002 | dragonslayr
DaveF is correct in directing you to the archives. This problem type has been discussed many times, it is quite common. Questions to ask yourself and provide us with answers are: It always happens or random? All assemblies or just one? solder paste
Electronics Forum | Thu Dec 07 07:36:15 EST 2006 | callckq
Hi Davef, The BGA pad is with ENIG finish, the PCB pad is with immersion silver and the solder paste is with SAC type. I already checked, the solder paste Cu is just 0.5%..Hence, I am guessing that copper migration is from PCB pad. No way it is fr
Electronics Forum | Mon Feb 12 10:06:46 EST 2007 | CK the Flip Guy
DaveF, Please define a "Cp/Cpk capable profiler." Do you mean one that has software that automatically calculates this for you? I do this at my company, and we track 2 critical variables - Time Above Liquidous and Peak Temps. and this is done on a
