Electronics Forum: balls have cracks (Page 8 of 215)

Soldering robot and solder balls

Electronics Forum | Wed Jun 21 11:30:27 EDT 2017 | ranap121212

but we do not have laminate preheating on robots. There is no flux separate application, the flux is in the soldering wire

Soldering robot and solder balls

Electronics Forum | Wed Jun 21 19:01:48 EDT 2017 | mac5

Try baking the boards; you may have a moisture problem.

Solder balls on gold pad

Electronics Forum | Wed Jul 17 02:32:13 EDT 2002 | computer

Hi, Anybody with a solution on solder balls on gold pad. I have tried the following a) Check cleanliness of solder paste printing area b) Clean stencils on 1 clean per 2 prints c) Use N2 on the reflow oven. Any other methods...

Solder balls on Cleaned process

Electronics Forum | Wed Oct 17 19:12:32 EDT 2001 | scott

Dave's right! Wash the boards RIGHT AFTER reflow, don't let that residue harden. Then you turn around and cure that stuff during the second reflow by not performing the first wash???? wow.... By the way, are you having any problems with white resi

PBGA vias throwing solder balls

Electronics Forum | Wed Sep 15 22:43:24 EDT 2004 | davef

Just to help convince those on the fence that we don't know dip: 2221A, 4.5.1 tells you the vias have to be tented on both sides.

PBGA vias throwing solder balls

Electronics Forum | Thu Sep 16 15:01:13 EDT 2004 | russ

You may want to either open up the bottom of the vias so they will not "volcano". Or you will want to seal both sides. It never works having one side of the vias masked and the other open with HASL. Russ

PBGA vias throwing solder balls

Electronics Forum | Sat Sep 18 08:26:10 EDT 2004 | davef

Carol: If you would have problems both covering the via and keeping mask from the BGA pads, maybe you via are too close to the pads. Maybe some of the IPC pad design guidelines would help.

Palladium finish and solder balls

Electronics Forum | Thu Jun 27 21:28:42 EDT 2002 | davef

You're correct that the Ni/Pd termination seems to have something to do with you solder balling. It could be related to the interaction between your paste and the Pd. I assume these are really 'fines' rather than 'balls'. Things that come to mind a

Re: solder balls and flux

Electronics Forum | Wed Mar 01 10:46:26 EST 2000 | Robert Hartmann

Kelvin, Thanks for the help. The actual opening size is .440 mm, but I think what you said makes sense. After discussing with the customer, it looks like it is the height which matters, more than the diameter. We have learned that the height of t

Re: solder balls and flux

Electronics Forum | Wed Mar 01 10:46:26 EST 2000 | Robert Hartmann

Kelvin, Thanks for the help. The actual opening size is .440 mm, but I think what you said makes sense. After discussing with the customer, it looks like it is the height which matters, more than the diameter. We have learned that the height of t


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