Industry News: bga and corrosion (Page 8 of 32)

ZESTRON's Advanced Packaging and Power Electronics Webinar Series Continues with "Corrosion in Power Electronics."

Industry News | 2023-09-11 17:06:45.0

ZESTRON is excited to announce the next installment of the Advanced Packaging and Power Electronics webinar series, "Corrosion in Power Electronics" is set to take place on September 21, 2023, at 2:00 PM EST.

3M Electrical Solutions Division

Kester to Exhibit Leading Fluxes, Pastes and Wires at SMTA Atlanta

Industry News | 2009-04-13 16:23:27.0

ITASCA, IL � April 2009 � Kester announces that it will exhibit leading fluxes, pastes and wires at the upcoming 13th Annual Atlanta Expo, scheduled to take place Thursday, April 16, 2009 at the Gwinnett Civic Center in Duluth, GA.

Kester

Prototype and Debug 96 ball BGA with Ease

Industry News | 2011-02-14 16:05:28.0

Design engineers using 0.8mm pitch 96 position BGA ICs will be interested in the PA-BGA96C-Z-01 probing and prototyping adapter with GHz BGA socket from Ironwood Electronics. Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing clock driver IC's. The socket is constructed with high performance and low inductance elastomer contactor.

Ironwood Electronics

Reworkable Underfill Encapsulant for CSP's and BGA's

Industry News | 2003-09-25 13:32:47.0

Reduce waste and cost.

Zymet, Inc

FPGAs and Microcontrollers

Industry News | 2018-10-18 10:34:11.0

FPGAs and Microcontrollers

Flason Electronic Co.,limited

Metcal, Nikon and Nordson ASYMTEK to Co-Host BGA Rework and Repair and X-Ray Inspection Seminar at ACI Technologies in Philadelphia

Industry News | 2013-05-01 20:51:31.0

Metcal today announced an additional date for its 2013 Spring series of BGA rework and repair seminars, this time co-hosting with Nikon and Nordson ASYMTEK.

OK International

STI Electronics' BGA Reballer Kit Saves Money and Components

Industry News | 2010-09-26 16:12:24.0

STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that its BGA Reballer Kit allows components to be reused.

STI Electronics

Reworkable Edgebond Adhesive Improves CBGA and BGA Thermal Cycle Performance and Eliminates Underfill

Industry News | 2011-04-07 20:23:54.0

Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. In one trial, UA-2605 tripled the 0°C to +100°C performance of a CBGA, to nearly 2500 cycles. Previously, an underfill was needed to achieve this level of performance.

Zymet, Inc

KIC and Air-Vac to Hold Free BGA Manufacturing and Repair Seminar

Industry News | 2009-10-13 12:56:51.0

San Diego — October 2009 — KIC, the leader of thermal process development and control products, and winner of multiple industry awards, in conjunction with Air-Vac Engineering Company will hold a free BGA Manufacturing and Repair Seminar at 6 p.m. on Friday, October 23, 2009 at the Hotel Radisson Case Grande, Ciudad Juarez in Juarez, Mexico.

KIC Thermal

Kyzen and ACI Technologies to Hold Joint Workshop to Discuss Circuit Board Cleaning and Conformal Coating

Industry News | 2012-03-15 18:09:12.0

Kyzen will co-host a workshop with ACI Technologies, Inc. to discuss circuit board cleaning and conformal coating. The workshop is scheduled to take place March 21-22, 2012 from 8:30 a.m.-4:30 p.m. at ACI’s facility in Philadelphia, PA.

KYZEN Corporation


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