Industry News: bga and delamination (Page 8 of 23)

Nordson DAGE and Rockwell Collins Co-author Technical Paper on Voiding in Ball Grid Arrays

Industry News | 2011-09-23 22:09:26.0

Nordson DAGE announces that a Technical Paper entitled "The Last Will and Testament of the BGA Void" will be presented at the SMTA International Conference & Exhibition.

Nordson DAGE

Systech Europe and XJTAG offer enhanced testing

Industry News | 2017-11-08 07:18:03.0

XJTAG, a world leading supplier of boundary scan technology and Systech Europe, a leading European provider of electronic test solutions, today announced the availability of an integrated solution using XJTAG boundary scan and Takaya’s flying probe system.

XJTAG

SHENMAO SMF-WC53 Water-Soluble Ball-Attach Flux and Solder Sphere

Industry News | 2019-06-02 18:40:27.0

SHENMAO America, Inc. introduces SMF-WC53 Water Soluble Ball-Attach Flux and Solder Sphere for use in ball-attach processes. With excellent solderability and high reliability, SHENMAO’s solder sphere can be used in a wide range of solder applications with various sizes from 50-760 μm.

Shenmao Technology Inc.

Soldering and Joint Encapsulation with One Step Reflow from SHENMAO

Industry News | 2021-08-26 11:02:27.0

SHENMAO America, Inc.'s Joint Enhanced Solder Paste (JEP) PF606-EP305 offers the advantages of both conventional solder paste and anisotropic conductive paste, i.e., self-alignment and planar insulation, respectively. JEP enables soldering and joint encapsulation in one step reflow.

Shenmao Technology Inc.

Circuit Technology Center Announces New Component Trim and Form Service

Industry News | 2023-11-13 12:31:47.0

Circuit Technology Center announces it has added the capability to trim and form electronic component packages to customers' exact pre-assembly specifications. They can also propose a trim and lead-form drawing if needed. Dedicated, custom tooling can be fabricated to meet custom package requirements.

Circuit Technology Center, Inc.

Intel and VJ Technologies to Present Pad Site Dress Methods at SMTAI 2010

Industry News | 2010-09-27 23:15:26.0

VJ Technologies, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, announces that Intel’s James Wade and Raiyo Aspandiar, along with VJ Technologies’ Donald Naugler and Terry Leahy will present a paper titled “PCB Pad Site Dress Methods on BGA and Socket Pad Arrays” at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

VJ Electronix

Etek Europe appointed as UK and Irish distributor of PDR - Rework Systems.

Industry News | 2016-01-19 15:21:34.0

Etek Europe are proud to announce that they have been appointed as the UK and Irish distributor for PDR – IR Rework Systems.  This appointment extends their distribution coverage which currently includes Algeria, Bulgaria, Finland, Hungary, Norway, Poland, Qatar, Romania, Saudi Arabia, Sweden, Tunisia, Ukraine, and United Arab Emirates.

Etek Europe

APS Novastar Introduces Automated Vision Control for L-Series Pick and Place Systems

Industry News | 2008-10-07 12:56:56.0

APS Novastar introduces automatic Vision Control for its L-Series pick and place systems. Vision Control advances the already precise, fast and reliable placement of 0201's with 100% accurate on-the-fly, bottom-up vision placement of micro BGA's and ultra fine pitch QFP's.

DDM Novastar Inc

VJE’s Don Naugler to Discuss X-ray Technology and BGA Inspection at the BEST Tech Symposium

Industry News | 2012-07-24 10:54:50.0

VJ Electronix, Incannounces that company President Don Naugler will present at the upcoming “Sharpening Your Tools-Area Array Technology”

VJ Electronix

Torenko and Associates Announces Vapor Phase Solder Seminar to be Held by IBL Technologies’ CEO Jochen Lipp at SMTA Houston Chapter Meeting

Industry News | 2010-07-29 14:30:50.0

Torenko and Associates, a leading manufacturers’ representative organization specializing in the sales and marketing of premier electronic assembly equipment, production tools, test, inspection, and consumable products to the regional USA, announces that Jochen Lipp, CEO of IBL Technologies, will hold a Vapor Phase Solder seminar and onsite demonstration at the upcoming SMTA Houston Chapter meeting. The meeting is scheduled to take place Thursday, August 19, 2010 from 6-9 p.m. at TS3 Technology, Inc. in Stafford, TX. Torenko and Associates represents IBL Technologies in Texas and Mexico.

Torenko & Associates


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