Industry News | 2012-07-24 10:54:50.0
VJ Electronix, Incannounces that company President Don Naugler will present at the upcoming “Sharpening Your Tools-Area Array Technology”
Industry News | 2010-05-29 18:57:32.0
MARTIN will demonstrate the Reball/Prebump 03.1 unit at the upcoming SMTA Upper Midwest Expo, scheduled to take place Wednesday, June 9, 2010, at the Sheraton Bloomington Hotel in Bloomington, MN. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.
Industry News | 2003-05-21 17:55:13.0
Michigan EMS provider achieves TS/ISO 16949:2002
Industry News | 2009-04-13 16:26:48.0
MADISON, AL � April 2009 � STI Electronics Inc., a full service organization providing training, electronic and industrial product distribution, assembly and solder training kits, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces its Engineering, Distribution and Training Services will be featured at the upcoming 13th Annual Atlanta Expo, scheduled to take place Thursday, April 16, 2009 at the Gwinnett Civic Center in Duluth, GA.
Industry News | 2013-11-27 15:30:07.0
Martin introduced its new rework Process Shuttle that streamlines flux and solder paste dipping or printing, and pre-positions the smallest surface mountable devices (SMDs) for pickup. This enhancement to the company's EXPERT 10.6 rework system was designed to increase the efficiency and quality of the work performed.
Industry News | 2016-08-29 18:40:48.0
Kurtz Ersa North America is pleased to announce that it will exhibit in Booth #1034 at SMTA International, scheduled to take place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL. Ersa’s team will demonstrate the HR 550 Rework system, Ersa Mobile Scope, i-CON VARIO 4 and Smartflow 2020.
Industry News | 2020-08-05 23:24:39.0
welcome to visit Unicomp and learn more about Unicomp electronics X-Ray machine at the Booth No. 1A23.
Industry News | 2016-05-16 16:16:21.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity.
Industry News | 2021-11-14 21:01:12.0
Productronica 2021 is an innovative, unrivaled, and international event. This is one of its kind of events that showcase the entire value chain in the production industry of electronic goods – from technology and components to software and services, including supply chain, Stencil Screen Printer, Pick & Placer, SPI, Reflow over, X-Ray inspection, BGA repair and maintenance. As an international trade fair, Productronica Munich 2021 covers the entire range of present and futuristic products, technologies, and system solutions.
Industry News | 2014-04-08 09:39:42.0
Metcal today announced the venues for the next two stops on its 2014 rework tour.
