Electronics Forum: bga and re-work (Page 8 of 35)

BGA's and the Fuji IP2

Electronics Forum | Mon Jul 15 17:35:42 EDT 2002 | davef

Micro BGA � (�BGA�). A Tessera brand name for a fine [0.5 mm and 0.75 mm solder ball] pitch BGA.

Hyper BGA and Super BGA

Electronics Forum | Fri Jul 02 08:24:16 EDT 2004 | davef

HyperBGA: http://www-306.ibm.com/chips/techlib/techlib.nsf/techdocs/852569B20050FF7785256996004C8AFA/$file/hyperbga.pdf SuperBGA: http://www.amkor.com/Products/all_products/sbga.cfm

Re-Balling BGA and BGA sockets

Electronics Forum | Fri Jan 15 11:25:29 EST 1999 | E. R.

Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then process

BGA's and the Fuji IP2

Electronics Forum | Fri Jul 12 12:52:14 EDT 2002 | pjc

I believe its called a BGA Clamp.

BGA's and the Fuji IP2

Electronics Forum | Fri Jul 12 13:02:22 EDT 2002 | rocco

Hello !! One basic question ....Which pitch is considered micro BGA ? Thanks !!

BGA ball and PCB pad

Electronics Forum | Fri Feb 13 11:19:07 EST 2004 | Evtimov

Hi Bryan The answer is in the paste compozition. Balls of the BGA are usually made by eutetic solder paste.

BGA's and the Fuji IP2

Electronics Forum | Thu Jul 11 17:26:27 EDT 2002 | Tony B

Does anyone know how the Fuji IP2 can be adapted to place BGA's? The MTU places the chip on a carrier with suction in the center and it will not hold on to the BGA due to the lack of a flat surface on the bottom. I have had limited success building

BGA's and the Fuji IP2

Electronics Forum | Sun Jul 14 05:37:17 EDT 2002 | johnw

Hi all bga placcement on an ip2 can is possible although as pointed out the x/y dimensionsof the part are used for placement I would suggest you arrange for your parts to be taped and reeled as this is the prefered way to go what size are the bga,s

Hyper BGA and Super BGA

Electronics Forum | Wed Jul 07 18:36:17 EDT 2004 | russ

We place both of these packages on a regular basis and experience no issues. Just run 'em like any other BGA. Russ

CSP and BGA soldering difference.

Electronics Forum | Fri Apr 06 09:45:08 EDT 2007 | pjc

CSP= Chip Scale Package, meaning small. A MicoBGA is a CSP, while a regular BGA is not a CSP. CSPs require fewer steps to fabricate than standard BGAs. A commonly quoted definition of a CSP is a package where the body size is


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