Industry News: bga and reflow and temperature (Page 8 of 20)

Solutions for Reflow and Wave Soldering Optimization, Inspection and Traceability from KIC at SMTconnect

Industry News | 2022-04-13 10:14:24.0

KIC will exhibit in Hall 4, Stand 452 at SMTconnect, scheduled to take place May 10-12, 2022 in Nuremberg. KIC are thermal process experts who make ovens smarter. Along with Reflow Process Inspection (RPI) and Wave Process Inspection (WPI), the KIC team will discuss NPI setup, process and recipe optimization for reduced defects, improved OEE, oven performance tracking, and their complete ecosystem of solutions for thermal processes.

KIC Thermal

Metcal to Host Series of BGA Rework and Repair Seminars

Industry News | 2013-03-25 15:21:46.0

OK International’s Metcal brand today announced the schedule for its 2013 Spring series of BGA rework and repair seminars.

OK International

KIC in Booth #3101 at SMTAI: Solutions for Reflow and Wave Soldering Optimization, Inspection and Traceability

Industry News | 2021-10-07 15:10:50.0

KIC will exhibit in Booth #3101 at SMTA International, scheduled to take place Nov. 3 - 4, 2021 at the Minneapolis Convention Center in Minneapolis, MN. Along with Reflow Process Inspection (RPI) and Wave Solder Process Inspection (WPI), the KIC team will discuss NPI setup, process optimization for reduced defects, improved OEE, and their complete ecosystem of solutions for thermal processes.

KIC Thermal

MARTIN to Demonstrate Stand Alone QFN Solder Bumping and BGA Reball Unit at the CTEA Austin Expo & Tech Forum

Industry News | 2010-10-04 15:37:18.0

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming Central Texas Electronics Association (SMTA/IMAPS) Expo & Tech Forum, scheduled to take place, October 7, 2010 at the Norris Conference Centers in Austin, TX.

Finetech

MARTIN to Demonstrate Stand Alone QFN Solder Bumping and BGA Reball Unit at the SMTA Arizona-Sonora Expo & Tech Forum

Industry News | 2010-11-18 11:04:08.0

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Arizona-Sonora Expo & Tech Forum, scheduled to take place Wednesday, December 1, 2010 at the Fiesta Inn Resort & Conference Center in Tempe, AZ.

Finetech

Aries' New Cost-Effective CSP/MicroBGA Test and Burn-In Socket

Industry News | 2003-07-08 09:09:15.0

Available for Devices Up to 13 mm2 with Speeds Up to 1 GHz

Aries Electronics Inc

New AT-GDP Series BGA Rework Station Provides the Latest Precision and Process Control

Industry News | 2009-09-23 21:53:53.0

Advanced Techniques US (ATCO)announces the development of an AT-GDP Series BGA Rework Station. Precise mechanics coupled with a comprehensive software package automates the device removal and installation processes. This model handles both leaded and lead-free applications consisting of components such as BGA’s, CSP’s, QFN’s, Flip Chips, and other SMD’s.

Advanced Techniques US Inc. (ATCO)

KIC to Showcase the ProBot at the IPC APEX EXPO KIC’s ProBot Automatic Profiling System complements AOI and X-ray Inspection

Industry News | 2014-02-17 20:20:58.0

IC today announced that it will showcase the affordable and easy-to-use ProBot automatic profiling system in Booth #1336 at the IPC APEX Expo, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.

KIC Thermal

RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ

Industry News | 2018-12-08 03:24:24.0

RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ

Flason Electronic Co.,limited

BTU to Show PYRAMAX and Profile Guardian at NEPCON China

Industry News | 2018-03-29 20:34:39.0

BTU International will exhibit at NEPCON China, scheduled to take place April 24-26, 2018 at the Shanghai World EXPO Exhibition & Convention Center. The company will showcase the Profile Guardian Redundant Process Monitor and PYRAMAX™ 125N Reflow Oven in Stand 1F25.

BTU International


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