Industry News: bga baking time (Page 8 of 47)

Seika Machinery to Exhibit at SMTA Dallas 2009

Industry News | 2009-03-02 00:10:24.0

TORRANCE, CA � February 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will verbally represent its complete line of products and technologies at the upcoming SMTA Dallas Expo and Tech Forum, scheduled to take place Tuesday, March 3, 2009 at the Richardson Civic Center in Richardson (Dallas), Texas. Michelle Ogihara, Seika Machinery's Sales and Marketing Manager, will have product brochures available in the booth. Additionally, she will be available to answer questions about the company's products.

Seika Machinery, Inc.

Seika Partners with Cogiscan to Offer MSD Control for McDry Cabinets

Industry News | 2020-05-12 12:32:14.0

Seika Machinery, Inc. today announced that it has partnered with Cogiscan to provide MSD Control for its McDry cabinets. As a result of the collaboration with Cogiscan, Seika offers precise tracking of the real-time location and remaining floor life of individual trays and reels containing MSDs – from the time they are removed from their protective dry bag, through placement, and final reflow.

Seika Machinery, Inc.

Indium8.9HF1-P Delivers High First Pass Yields for In-circuit Testing

Industry News | 2013-12-10 12:14:34.0

Indium Corporation introduces a new Pb-free solder paste designed to combine best-in-class stencil printing performance, using Indium's unique halogen-free oxidation barrier technology with optimized no-clean residues for enhanced probe testing. Indium8.9HF1-P saves time and money on testing by eliminating false failures and giving the highest first pass yields.

Indium Corporation

Seika to Show the New McDry DXU-1001A UL High-Performance, Quick Dehumidifying Model with DicksonOne Data Logger at APEX

Industry News | 2018-02-03 07:33:32.0

Seika Machinery today announced plans to introduce the new McDry DXU-1001A UL, Quick Dehumidifying Model, with DicksonOne Data Logger. Company representatives will show the system with the DicksonOne Data Logger for the first time in Booth #2043 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca.

Seika Machinery, Inc.

Agilent Technologies Unveils Industry's First DDR2, DDR3 BGA Probe Solution for Oscilloscopes, Logic Analyzers

Industry News | 2008-01-28 23:33:58.0

Agilent Technologies Inc. (NYSE: A) today unveiled the industry's first DDR2 and DDR3 ball-grid array (BGA) probes for oscilloscopes and logic analyzers. The probes will be shown for the first time at DesignCon, here in Santa Clara, Feb. 4-6, 2008, Booth 305.

Agilent Technologies, Inc.

Prices Slashed � Jovy Systems RE-7500 BGA Rework Station

Industry News | 2009-04-02 09:23:02.0

Economic woes � Chinese companies vie for increased sales

AVRepair, Inc.

AV REPAIR TO DISTRIBUTE JOVY SYSTEMS' RE-7500 BGA REWORK SYSTEM

Industry News | 2008-08-03 12:48:00.0

New Lead-free compatible, IR-based Unit Reworks all BGA components, including Plastic parts, PTH Sockets, SMD Connectors and Metal Shields

AVRepair, Inc.

MicroCare Unveils New Flux Remover Packaging at IPC APEX 2018

Industry News | 2018-03-01 19:44:00.0

MicroCare Corp. stunned the PCB cleaning industry with a flurry of innovation at the massive IPC APEX EXPO in San Diego, CA this week with the launch of ten new cleaning products. Featured among these developments are popular flux-cleaning chemistries in a new, super-convenient, pocket-sized cleaning pen package. The new range features three formulations: the No-Clean Flux Remover, the RMA Flux Remover, and the Water-Soluble Flux Remover Pens. These three new cleaners have been designed to specifically remove fluxes quickly and safely and ensure PCBs will enjoy a long and productive life at the lowest possible cost.

MicroCare Corporation

STI Electronics' BGA Reballer Kit Saves Money and Components

Industry News | 2010-09-26 16:12:24.0

STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that its BGA Reballer Kit allows components to be reused.

STI Electronics

ECD Taps Todd Clifton to Lead Company.

Industry News | 2014-09-11 02:05:51.0

ECD has named Todd Clifton as the company's new President to succeed founder and former President, Rex Breunsbach, who is downsizing his role at ECD. Clifton previously was ECD’s Vice-President of Sales and Marketing.

Electronic Controls Design Inc. (ECD)


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