Industry News | 2019-05-20 18:57:09.0
SMTA recently released the Guide to BGA Assembly & Soldering Defects, a complimentary resource for the electronics manufacturing industry. The book was written by Keith Bryant, industry veteran and Chairman of the SMTA Europe Chapter, and reviewed by members of the SMTA Europe Technical Committee.
Industry News | 2016-01-17 19:26:58.0
In order to keep up with industry demand, IPC has released amendments for J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610F, Acceptability of Electronic Assemblies. For each standard, IPC-A-610F Amendment 1 and IPC J-STD-001F Amendment 1 represents a critical shift to deliver necessary updates to these already robust standards.
Used SMT Equipment | Pick and Place/Feeders
SAMSUNG CP63HP / CP63 High Speed Mounting Machine CP63HP Under IPC9850 conditions, the mount speed is 30,000 CPH The mount range is 0603(imperial 0201) ~ 24mm components, including BGA, QFP PCB large size Max. 500Mm * 400mm Additional 116 8mm fee
Industry News | 2018-12-08 03:25:54.0
Basic Soldering Guide – How to Solder Electronic Components
Industry News | 2010-04-10 02:05:54.0
IPC released today the A revision of IPC J-STD-609, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes. This standard presents a marking and labeling system that aids in electronics assembly, rework, repair and recycling, and now provides additional codes for the more precise specification of certain lead-free solders.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Industry News | 2009-06-11 12:25:44.0
Company Expands Training Services
Industry News | 2015-02-04 18:05:58.0
he SMTA Capital Chapter is pleased to announce its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164. The focus of this chapter meeting will be “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” presented by Donald Tyler, Managing Director, Corfin Industries.
Industry News | 2015-03-11 18:05:46.0
The SMTA Capital Chapter is pleased to announce Donald Tyler, Managing Director, Corfin Industries, will present “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” at its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164.
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