Electronics Forum | Wed Sep 14 15:42:45 EDT 2011 | nowak18
During temperature cycling we have determined that the conformal coating wicking underneath our BGAs has caused fractures in our solder balls. One proposed solution is to run an RTV dam around the parameter of the BGA to prevent the CC from wicking u
Electronics Forum | Tue Oct 03 09:23:55 EDT 2006 | kenscj
We are encountering BGA solder open connection. At Functional Test, the board failed. Debug guy diagnosed this BGA open connection (2 locations), by using multimeter. Under 5DX inspection, there is connection. Take the board for localised reflow at
Electronics Forum | Tue Apr 22 03:46:19 EDT 2008 | fowlerchang
It is CSP reliability issue, which is the mobile CPU from Spreadtrum. All the tests passed and shipped to customer. They assembly them and tested but failed. After they reflow this CSP with hot air gun, some of the boards passed. We got some board
Electronics Forum | Thu Dec 01 14:47:25 EST 2005 | Amol Kane
Hi, I am testing some lead-free assemblies using ATC. it was suggested to me that if i do in-situ testing, then i should measure the starting resistance, and subsequent resistances values after n cycles, and when the resistance value increases by 1 o
Electronics Forum | Wed Dec 06 22:46:39 EST 2006 | SMTrework
Hi Dave, This is manufacturer applied epoxy / adhesive to minimize package "lifing" from chassis flexing and thius board flexing. I have seen the complete array area covered with this black or red epoxy in some cases (i.e. the underfill that I've
Electronics Forum | Mon Mar 21 02:41:29 EDT 2011 | kemasta
Hi It's me again. Our products need to pass a chamber test 45c/36hrs after the PCBA completed batch of functional tests and assemble in to case. We found 1 unit was functioning for 24hours in the chamber, but hang after that. We tried to re-boot the
Electronics Forum | Thu Jan 18 10:59:26 EST 2007 | aj
All, apologies for dragging this thread up again but after some xray analysis it looks like there is no issue with the soldering of any components namely 2 x bga and 1 qfn device which are placed within the shielding area..but yet they fail to perfo
Electronics Forum | Tue Apr 13 21:33:48 EDT 2004 | qualitel
Hi Dreamsniper, It seen this is the major issue had been occurs you.( We had face all this issue last time too) We had done a lot of areospace products before and most of ours products is a must on class 3 spec. BGA is not that tough t
Electronics Forum | Fri May 23 00:16:31 EDT 2014 | edriansyah
Hello all. I need you advice and opinion on my problem with BGA drop off from the boards. Initial defect was ICT fail, but due to some accident, the board fell off, and the BGA just pop out. After some search, I end up to conclude it is a black pad
Electronics Forum | Mon Apr 14 12:40:28 EDT 2003 | jimcorr
They are letting you go on holiday with these problems outstanding??!! But seriously after reading about your problems I think that any further work is basically throwing good ��$$ after bad and reworking BGA almost always ensure that they will fail
