Electronics Forum | Sun May 08 00:07:42 EDT 2005 | Dr . Klein
Hello mrmaint You say that you do 100% incoming inspection at your site, Do you open every tray and look on the writing on every type of component? If you open the bag, how do you close it again (vacuum machine)? What is the inspection process? (Only
Electronics Forum | Tue May 10 00:09:46 EDT 2005 | Dr . Klein
Hello (pwh) I would like to know more about your process. What is the rezone you open the bags? Do you put any stamp on the opened trays before you enter them to the mcdry? What kind of inspection do you make before you enter the trays to the mcdry?
Electronics Forum | Tue Jan 30 02:29:16 EST 2001 | arul2000
Dave, To do further analysis we don't have the BGAs of the batch from which we had this issue. We don't face this issue now in the current production lots. The problem got solved while trying to find the root cause. Will keep updated if it occurs ag
Electronics Forum | Wed Jun 25 12:08:53 EDT 2003 | russ
I battle this all the time, I don't believe that it is the "gold corner" that is causing the problem but something with the PCB layer makeup (copper planes, or bottom side components, etc.). It could also be the nozzle you are using has a "hot spot/
Electronics Forum | Mon Nov 06 09:38:55 EST 2000 | Dean Stadem
We have seen this problem several times. It always goes back to pad solderability, very seldom does it have anything to do with ball size. If there is no evidence of wetting on that pad, but all of the other pads did solder, you need to ask yourself
Electronics Forum | Thu Oct 14 09:33:10 EDT 2010 | sachinnalbalwar
Hi All, Is there any way to use ROHS6/6 [Non-leaded] BGA device in Non-ROHS reflow [240 Deg C] temp. environment. I need to do this because Leaded [ROHS5/6] device I was using is obsolete and Non-leaded[ROHS6/6] drop-in-replacement part is availab
Electronics Forum | Wed May 04 04:31:44 EDT 2005 | siverts
What is the MS-level and floor life of the critical components (should be written on the MSD-bag)? What is Your climate condition in the production area (%RH, temp.)? Are you doing this inspection on every board or is it enough to do it on the first
Electronics Forum | Fri Jan 19 17:43:30 EST 2001 | davef
Intermetalic Layer (IL). A compound formed at the interface of two different metals, whose atoms have an extremely high natural attraction for each other, so high, that they do not bond to other elements by any other means. Also, intermetalic compo
Electronics Forum | Wed May 19 07:38:42 EDT 2004 | Bob L.
I'm trying to help one of our remote sites solve a problem with a warped PBGA. The corners are lifted, creating columnar joints and the central balls are sometimes shorting. I've verified that it's not popcorning and I've got samples going to the l
Electronics Forum | Mon Oct 18 11:43:42 EDT 2010 | hegemon
Use the forums nice search feature above. "Lead Free BGA" Lots of info. In short it seems the general consensus is that you are pretty much safe using your lead free BGA in a tin lead process, provided you run your peaks a little higher, and your
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