Industry News | 2010-08-27 07:25:03.0
Package on Package (PoP) applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers.
Industry News | 2009-09-17 17:02:12.0
EAST HANOVER, NJ – Zymet has introduced a new reworkable underfill encapsulant, CN-1728, designed to underfill Package-on-Package (POP) assemblies. Underfilled POP’s have greater difficulty in passing thermal cycle tests than underfilled BGA’s. Compared to earlier generation underfills, CN-1728 has a lower coefficient of thermal expansion and higher Tg, and better compatibility with flux residues, both of which contribute to its superior thermal cycle performance.
Industry News | 2018-10-18 10:24:05.0
The Design Principles of Stencil Apertures
Industry News | 2018-12-08 03:33:27.0
How Electronic / Electrical Circuit Works
Industry News | 2011-10-07 23:08:54.0
MARTIN will showcase its Mini-Oven Reball/Solder Bumping unit at the upcoming SMTA LA/Orange County Expo & Tech Forum.
Industry News | 2022-07-16 08:39:50.0
SHENMAO America, Inc. is pleased to announce that the PF918-S Lead-Free BGA Sphere features the newly designed high-reliability alloy PF918 that can achieve tensile strength performance 1.4 times higher than the typical SAC305 alloy.
Industry News | 2010-01-11 14:37:46.0
January 2010 ? Christopher Associates, a pioneering supplier to the electronics manufacturing industry, announces that Jasbir Bath, Consulting Engineer with Christopher Associates/Koki Solder, will host a SMTA-sponsored Webinar titled “Reducing Head-in-Pillow with Tin/Lead and Lead-Free Solder Paste Development.” The Webinar will be held on Thursday, February 4, 2010 at 11 a.m. USA Eastern/8 a.m. USA Pacific time, and will run for approximately 60-90 minutes with a question and answer period.
Industry News | 2013-02-08 23:26:44.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1751-4, that is extraordinarily crack resistant, to withstand flexing experienced by flexible printed circuitry or drops and shocks of very thin printed circuit assemblies.
Industry News | 2012-01-13 13:20:53.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1736, designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solderpastes and tacky fluxes.
